I-3C-SiC Wafer Substrate

Incazelo emfushane:

I-Semicera 3C-SiC Wafer Substrates ihlinzeka ngokusebenza okushisayo okuphakeme kanye nogesi ophezulu wokuwohloka kagesi, ilungele amadivayisi kagesi kanye namaza aphezulu. Lawa ma-substrates enziwe ngokunembayo ukuze asebenze kahle ezindaweni ezinokhahlo, okuqinisekisa ukwethembeka nokusebenza kahle. Khetha i-Semicera ukuthola izixazululo ezintsha nezithuthukile.


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ama-Semicera 3C-SiC Wafer Substrates akhiwe ukuze anikeze inkundla eqinile yama-electronics wamandla wesizukulwane esilandelayo kanye namadivayisi anemvamisa ephezulu. Ngezakhiwo ezishisayo eziphakeme nezici zikagesi, lawa ma-substrates aklanyelwe ukuhlangabezana nezidingo ezidingekayo zobuchwepheshe besimanje.

Isakhiwo se-3C-SiC (Cubic Silicon Carbide) se-Semicera Wafer Substrates sinikeza izinzuzo ezihlukile, okuhlanganisa ukuqhutshwa kwe-thermal okuphezulu kanye ne-coefficient ephansi yokwandisa okushisayo uma kuqhathaniswa nezinye izinto ze-semiconductor. Lokhu kubenza babe ukukhetha okuhle kakhulu kumadivayisi asebenza ngaphansi kwamazinga okushisa aphezulu nezimo zamandla aphezulu.

Ngevoltheji ephezulu yokuphuka kukagesi nokuzinza kwamakhemikhali okuphakeme, i-Semicera 3C-SiC Wafer Substrates iqinisekisa ukusebenza okuhlala isikhathi eside nokwethembeka. Lezi zakhiwo zibalulekile ezinhlelweni zokusebenza ezifana ne-radar yefrikhwensi ephezulu, ukukhanya kwe-solid-state, neziguquli zamandla, lapho ukusebenza kahle nokuqina kubaluleke kakhulu.

Ukuzibophezela kwe-Semicera kwikhwalithi kubonakala enqubweni yokukhiqiza ecophelelayo ye-3C-SiC Wafer Substrates yabo, eqinisekisa ukufana nokuvumelana kuwo wonke amaqoqo. Lokhu kunemba kunomthelela ekusebenzeni okuphelele nasekuphileni isikhathi eside kwamadivayisi kagesi akhelwe phezu kwawo.

Ngokukhetha ama-Semicera 3C-SiC Wafer Substrates, abakhiqizi bathola ukufinyelela ezintweni ezisezingeni eliphezulu ezivumela ukuthuthukiswa kwezingxenye ze-elekthronikhi ezincane, ezisheshayo nezisebenza kahle kakhulu. I-Semicera iyaqhubeka nokusekela ukusungulwa kwezobuchwepheshe ngokunikeza izixazululo ezinokwethenjelwa ezihlangabezana nezidingo eziguqukayo zemboni ye-semiconductor.

Izinto

Ukukhiqiza

Ucwaningo

Dummy

I-Crystal Parameters

I-Polytype

4H

Iphutha lokuma kobuso

<11-20 >4±0.15°

Amapharamitha kagesi

I-Dopant

n-uhlobo lweNitrojeni

Ukungazweli

0.015-0.025ohm · cm

Mechanical Parameters

Ububanzi

150.0±0.2mm

Ubukhulu

350±25 μm

Umumo oyisicaba oyinhloko

[1-100]±5°

Ubude obuyisicaba obuyisisekelo

47.5±1.5mm

Ifulethi lesibili

Lutho

I-TTV

≤5 μm

≤10 μm

≤15 μm

I-LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Khothama

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

I-Wap

≤35 μm

≤45 μm

≤55 μm

Front(Si-face) roughness(AFM)

I-Ra≤0.2nm (5μm*5μm)

Isakhiwo

Ukuminyana kwe-Micropipe

<1 eya/cm2

<10 kwe/cm2

<15 kwe/cm2

Ukungcola kwensimbi

≤5E10 ama-athomu/cm2

NA

I-BPD

≤1500 i-e/cm2

≤3000 i-e/cm2

NA

I-TSD

≤500 i-e/cm2

≤1000 i-e/cm2

NA

Ikhwalithi Yangaphambili

Ngaphambili

Si

Ukuqedwa kobuso

I-Si-face CMP

Izinhlayiya

≤60ea/wafer (usayizi≥0.3μm)

NA

Ukuklwebheka

≤5ea/mm. Ubude obuqongelelwe ≤Ububanzi

Ubude obuqongelelwe≤2*Ububanzi

NA

Ikhasi eliwolintshi/imigodi/amabala/imifantu/ukungcola

Lutho

NA

Ama-Edge chips/indents/fracture/hex plate

Lutho

Izindawo ze-Polytype

Lutho

Indawo eqoqiwe≤20%

Indawo eqoqiwe≤30%

Ukumaka kwe-laser yangaphambili

Lutho

Ikhwalithi Emuva

Emuva ekupheleni

C-face CMP

Ukuklwebheka

≤5ea/mm,Ubude obuqongelelayo≤2*Ububanzi

NA

Ukukhubazeka kwasemuva (ama-edge chips/indents)

Lutho

Ukuhwalala emuva

I-Ra≤0.2nm (5μm*5μm)

Ukumaka kwe-laser emuva

1 mm (kusuka emaphethelweni aphezulu)

Umphetho

Umphetho

I-Chamfer

Ukupakisha

Ukupakisha

I-Epi-ilungile ngokufakwa kwe-vacuum

Ukupakishwa kwekhasethi le-multi-wafer

*Amanothi: "NA" kusho ukuthi asikho isicelo Izinto ezingashiwongo zingabhekisa ku-SEMI-STD.

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Ama-wafers e-SiC

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