6 Intshi N-uhlobo lwe-SiC Substrate

Incazelo emfushane:

I-Semicera inikeza ububanzi obubanzi be-4H-8H SiC wafers. Iminyaka eminingi, besingumkhiqizi kanye nomphakeli wemikhiqizo ezimbonini ze-semiconductor kanye ne-photovoltaic. Imikhiqizo yethu eyinhloko ihlanganisa: amapuleti e-silicon carbide etch, ama-silicon carbide boat trailer, izikebhe ze-silicon carbide wafer (PV & Semiconductor), amashubhu e-silicon carbide furnace, ama-silicon carbide cantilever paddles, ama-silicon carbide chucks, imishayo ye-silicon carbide, kanye ne-CVD ne-SiC coating. I-TaC coatings. Ihlanganisa izimakethe eziningi zaseYurophu nezaseMelika. Sibheke ngabomvu ukuba uzakwethu wesikhathi eside e-China.

 

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

I-Silicon carbide (SiC) i-crystal material eyodwa inobubanzi begebe lebhande elikhulu (~Si izikhathi ezi-3), ukuguquguquka okuphezulu kwe-thermal (~Si izikhathi ezingu-3.3 noma izikhathi ze-GaAs izikhathi ezingu-10), izinga lokufuduka kwe-electron ephezulu (~Si izikhathi ezingu-2.5), ukuphuka okuphezulu kukagesi inkambu (~Si 10 izikhathi noma GaAs izikhathi 5) kanye nezinye izici ezivelele.

Izinto ze-semiconductor yesizukulwane sesithathu ikakhulukazi zifaka i-SiC, i-GaN, idayimane, njll., ngoba ububanzi begebe lebhendi yayo (Isb) bukhulu noma bulingana nama-electron volts (eV) angu-2.3 (eV), owaziwa nangokuthi i-wide band gap semiconductor materials. Uma kuqhathaniswa nezinto zokwakha ze-semiconductor yesizukulwane sokuqala nesesibili, izinto zokwakha ze-semiconductor yesizukulwane sesithathu zinezinzuzo zokubamba okuphezulu okushisayo, insimu kagesi ewohlokayo, izinga eliphezulu lokufuduka kwama-electron namandla aphezulu okubopha, okungahlangabezana nezidingo ezintsha zobuchwepheshe besimanje be-elekthronikhi izinga lokushisa, amandla aphezulu, umfutho ophezulu, imvamisa ephezulu kanye nokumelana nemisebe nezinye izimo ezinzima. Inamathemba okusebenza abalulekile emikhakheni yezokuvikela kuzwelonke, ezondiza, i-aerospace, ukuhlola uwoyela, ukugcinwa kwamehlo, njll., futhi inganciphisa ukulahleka kwamandla ngaphezu kuka-50% ezimbonini zamasu eziningi ezifana nezokuxhumana nge-broadband, amandla elanga, ukukhiqiza izimoto, ukukhanya kwe-semiconductor, kanye negridi ehlakaniphile, futhi kunganciphisa umthamo wezinto zokusebenza ngamaphesenti angaphezu kwama-75, okubaluleke kakhulu ekuthuthukisweni kwesayensi yabantu nobuchwepheshe.

Amandla we-Semicera anganikeza amakhasimende izinga eliphezulu le-Conductive (Conductive), i-Semi-insulating (Semi-insulating), i-HPSI (i-High Purity semi-insulating) i-silicon carbide substrate; Ngaphezu kwalokho, singahlinzeka amakhasimende ngamashidi e-epitaxial e-silicon carbide e-homogeneous and heterogeneous; Singakwazi futhi ukwenza ngokwezifiso ishidi le-epitaxial ngokuya ngezidingo ezithile zamakhasimende, futhi abukho ubuncane be-oda lenani.

Izinto

Ukukhiqiza

Ucwaningo

Dummy

I-Crystal Parameters

I-Polytype

4H

Iphutha lokuma kobuso

<11-20 >4±0.15°

Amapharamitha kagesi

I-Dopant

n-uhlobo lweNitrojeni

Ukungazweli

0.015-0.025ohm · cm

Mechanical Parameters

Ububanzi

150.0±0.2mm

Ubukhulu

350±25 μm

Umumo oyisicaba oyinhloko

[1-100]±5°

Ubude obuyisicaba obuyisisekelo

47.5±1.5mm

Ifulethi lesibili

Lutho

I-TTV

≤5 μm

≤10 μm

≤15 μm

I-LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Khothama

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

I-Wap

≤35 μm

≤45 μm

≤55 μm

Front(Si-face) roughness(AFM)

I-Ra≤0.2nm (5μm*5μm)

Isakhiwo

Ukuminyana kwe-Micropipe

<1 eya/cm2

<10 kwe/cm2

<15 kwe/cm2

Ukungcola kwensimbi

≤5E10 ama-athomu/cm2

NA

I-BPD

≤1500 i-e/cm2

≤3000 i-e/cm2

NA

I-TSD

≤500 i-e/cm2

≤1000 i-e/cm2

NA

Ikhwalithi Yangaphambili

Ngaphambili

Si

Ukuqedwa kobuso

I-Si-face CMP

Izinhlayiya

≤60ea/wafer (usayizi≥0.3μm)

NA

Ukuklwebheka

≤5ea/mm. Ubude obuqongelelwe ≤Ububanzi

Ubude obuqongelelwe≤2*Ububanzi

NA

Ikhasi eliwolintshi/imigodi/amabala/imifantu/ukungcola

Lutho

NA

Ama-Edge chips/indents/fracture/hex plate

Lutho

Izindawo ze-Polytype

Lutho

Indawo eqoqiwe≤20%

Indawo eqoqiwe≤30%

Ukumaka kwe-laser yangaphambili

Lutho

Ikhwalithi Emuva

Emuva ekupheleni

C-face CMP

Ukuklwebheka

≤5ea/mm,Ubude obuqongelelayo≤2*Ububanzi

NA

Ukukhubazeka kwasemuva (ama-edge chips/indents)

Lutho

Ukuhwalala emuva

I-Ra≤0.2nm (5μm*5μm)

Ukumaka kwe-laser emuva

1 mm (kusuka emaphethelweni aphezulu)

Umphetho

Umphetho

I-Chamfer

Ukupakisha

Ukupakisha

I-Epi-ilungile ngokufakwa kwe-vacuum

Ukupakishwa kwekhasethi le-multi-wafer

*Amanothi: "NA" kusho ukuthi asikho isicelo Izinto ezingashiwongo zingabhekisa ku-SEMI-STD.

tech_1_2_size
Ama-wafers e-SiC

Semicera Indawo yokusebenza Indawo yokusebenza ye-Semicera 2 Umshini wezinsimbi Ukucutshungulwa kwe-CNN, ukuhlanza amakhemikhali, i-CVD coating Inkonzo yethu


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