I-Semicera's 6 Inch Semi-Insulating HPSI SiC Wafers yakhelwe ukuhlangabezana nezidingo ezinzima zobuchwepheshe besimanje be-semiconductor. Ngokuhlanzeka nokungaguquguquki okukhethekile, lawa mawafa asebenza njengesisekelo esithembekile sokuthuthukisa izingxenye ze-elekthronikhi ezisebenza kahle kakhulu.
Lawa mawafa e-HPSI SiC aziwa ngokuhambisa kwawo okushisayo okuvelele kanye nokufakwa kukagesi, okubalulekile ekuthuthukiseni ukusebenza kwamadivayisi kagesi namasekhethi anemvamisa ephezulu. Izici ze-semi-insulating zisiza ekwehliseni ukuphazamiseka kukagesi kanye nokukhulisa ukusebenza kahle kwedivayisi.
Inqubo yokukhiqiza yekhwalithi ephezulu eqashwe yi-Semicera iqinisekisa ukuthi i-wafer ngayinye inogqinsi olufanayo kanye nokukhubazeka okuncane kwendawo. Lokhu kunemba kubalulekile ezinhlelweni zokusebenza ezithuthukisiwe njengamadivayisi efrikhwensi yomsakazo, iziguquli zamandla, namasistimu e-LED, lapho ukusebenza nokuqina kuyizici ezibalulekile.
Ngokusebenzisa izindlela zokukhiqiza ezisezingeni eliphezulu, i-Semicera inikeza ama-wafers angagcini nje ngokuhlangabezana kodwa adlule izindinganiso zemboni. Usayizi ongu-6-intshi unikeza ukuguquguquka ekukhuphuleni ukukhiqizwa, ukunakekela kukho kokubili ucwaningo nezinhlelo zokusebenza zezentengiso emkhakheni we-semiconductor.
Ukukhetha i-Semicera's 6 Inch Semi-Insulating HPSI SiC Wafers kusho ukutshala imali emkhiqizweni oletha ikhwalithi nokusebenza okungaguquki. Lawa mawafa ayingxenye yokuzibophezela kwe-Semicera ekuthuthukiseni amakhono obuchwepheshe be-semiconductor ngokusebenzisa izinto ezintsha kanye nobuciko bobuciko obucophelelayo.
| Izinto | Ukukhiqiza | Ucwaningo | Dummy |
| I-Crystal Parameters | |||
| I-Polytype | 4H | ||
| Iphutha lokuma kobuso | <11-20 >4±0.15° | ||
| Amapharamitha kagesi | |||
| I-Dopant | n-uhlobo lweNitrojeni | ||
| Ukungazweli | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Ububanzi | 150.0±0.2mm | ||
| Ubukhulu | 350±25 μm | ||
| Umumo oyisicaba oyinhloko | [1-100]±5° | ||
| Ubude obuyisicaba obuyisisekelo | 47.5±1.5mm | ||
| Ifulethi lesibili | Lutho | ||
| I-TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| I-LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Khothama | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| I-Wap | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | I-Ra≤0.2nm (5μm*5μm) | ||
| Isakhiwo | |||
| Ukuminyana kwe-Micropipe | <1 eya/cm2 | <10 kwe/cm2 | <15 kwe/cm2 |
| Ukungcola kwensimbi | ≤5E10 ama-athomu/cm2 | NA | |
| I-BPD | ≤1500 i-e/cm2 | ≤3000 i-e/cm2 | NA |
| I-TSD | ≤500 i-e/cm2 | ≤1000 i-e/cm2 | NA |
| Ikhwalithi Yangaphambili | |||
| Ngaphambili | Si | ||
| Ukuqedwa kobuso | I-Si-face CMP | ||
| Izinhlayiya | ≤60ea/wafer (usayizi≥0.3μm) | NA | |
| Ukuklwebheka | ≤5ea/mm. Ubude obuqongelelwe ≤Ububanzi | Ubude obuqongelelwe≤2*Ububanzi | NA |
| Ikhasi eliwolintshi/imigodi/amabala/imifantu/ukungcola | Lutho | NA | |
| Ama-Edge chips/indents/fracture/hex plate | Lutho | ||
| Izindawo ze-Polytype | Lutho | Indawo eqoqiwe≤20% | Indawo eqoqiwe≤30% |
| Ukumaka kwe-laser yangaphambili | Lutho | ||
| Ikhwalithi Emuva | |||
| Emuva ekupheleni | C-face CMP | ||
| Ukuklwebheka | ≤5ea/mm,Ubude obuqongelelayo≤2*Ububanzi | NA | |
| Ukukhubazeka kwasemuva (ama-edge chips/indents) | Lutho | ||
| Ukuhwalala emuva | I-Ra≤0.2nm (5μm*5μm) | ||
| Ukumaka kwe-laser emuva | 1 mm (kusuka emaphethelweni aphezulu) | ||
| Umphetho | |||
| Umphetho | I-Chamfer | ||
| Ukupakisha | |||
| Ukupakisha | I-Epi-ilungile ngokufakwa kwe-vacuum Ukupakishwa kwekhasethi le-multi-wafer | ||
| *Amanothi: "NA" kusho ukuthi asikho isicelo Izinto ezingashiwongo zingabhekisa ku-SEMI-STD. | |||
