6 Intshi n-uhlobo lwe-sic substrate

Incazelo emfushane:

I-SiC substrate engu-6-intshi ye-n-type iyisisetshenziswa se-semiconductor esibonakala ngokusetshenziswa kosayizi we-wafer ongu-6-intshi, okwandisa inani lamadivayisi angakhiqizwa ngewafa eyodwa endaweni enkulu, ngaleyo ndlela kwehlise izindleko zezinga ledivayisi. . Ukuthuthukiswa nokusetshenziswa kwama-substrates angu-6-inch n-type SiC ahlomule ekuthuthukisweni kobuchwepheshe obufana nendlela yokukhula ye-RAF, enciphisa ukugudluka ngokusika amakristalu ahambisana nokugudluka kanye nezikhombisi-ndlela ezifanayo kanye namakristalu akhula kabusha, ngaleyo ndlela kuthuthukiswe ikhwalithi ye-substrate. Ukusetshenziswa kwale substrate kubaluleke kakhulu ekuthuthukiseni ukusebenza kahle kokukhiqiza kanye nokunciphisa izindleko zamadivayisi kagesi e-SiC.

 


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

I-Silicon carbide (SiC) i-crystal material eyodwa inobubanzi begebe lebhande elikhulu (~Si izikhathi ezi-3), ukuguquguquka okuphezulu kwe-thermal (~Si izikhathi ezingu-3.3 noma izikhathi ze-GaAs izikhathi ezingu-10), izinga lokufuduka kwe-electron ephezulu (~Si izikhathi ezingu-2.5), ukuphuka okuphezulu kukagesi inkambu (~Si 10 izikhathi noma GaAs izikhathi 5) kanye nezinye izici ezivelele.

Izinto ze-semiconductor yesizukulwane sesithathu ikakhulukazi zifaka i-SiC, i-GaN, idayimane, njll., ngoba ububanzi begebe lebhendi yayo (Isb) bukhulu noma bulingana nama-electron volts (eV) angu-2.3 (eV), owaziwa nangokuthi i-wide band gap semiconductor materials. Uma kuqhathaniswa nezinto zokwakha ze-semiconductor yesizukulwane sokuqala nesesibili, izinto zokwakha ze-semiconductor yesizukulwane sesithathu zinezinzuzo zokubamba okuphezulu okushisayo, insimu kagesi ewohlokayo, izinga eliphezulu lokufuduka kwama-electron namandla aphezulu okubopha, okungahlangabezana nezidingo ezintsha zobuchwepheshe besimanje be-elekthronikhi izinga lokushisa, amandla aphezulu, umfutho ophezulu, imvamisa ephezulu kanye nokumelana nemisebe nezinye izimo ezinzima. Inamathemba okusebenza abalulekile emikhakheni yezokuvikela kuzwelonke, ezondiza, i-aerospace, ukuhlola uwoyela, ukugcinwa kwamehlo, njll., futhi inganciphisa ukulahleka kwamandla ngaphezu kuka-50% ezimbonini zamasu eziningi ezifana nezokuxhumana nge-broadband, amandla elanga, ukukhiqiza izimoto, ukukhanya kwe-semiconductor, kanye negridi ehlakaniphile, futhi kunganciphisa umthamo wezinto zokusebenza ngamaphesenti angaphezu kwama-75, okubaluleke kakhulu ekuthuthukisweni kwesayensi yabantu nobuchwepheshe.

Amandla we-Semicera anganikeza amakhasimende izinga eliphezulu le-Conductive (Conductive), i-Semi-insulating (Semi-insulating), i-HPSI (i-High Purity semi-insulating) i-silicon carbide substrate; Ngaphezu kwalokho, singahlinzeka amakhasimende ngamashidi e-epitaxial e-silicon carbide e-homogeneous and heterogeneous; Singakwazi futhi ukwenza ngokwezifiso ishidi le-epitaxial ngokuya ngezidingo ezithile zamakhasimende, futhi abukho ubuncane be-oda lenani.

IMIKHIQIZO EYISISEKELO

Usayizi

 6-intshi
Ububanzi 150.0mm+0mm/-0.2mm
I-Surface Orientation i-off-eksisi:4° ibheke<1120>±0.5°
Ubude Befulethi obuyisisekelo 47.5mm1.5 mm
Isisekelo se-Flat Orientation <1120>±1.0°
Ifulethi lesibili Lutho
Ubukhulu 350.0um±25.0um
I-Polytype 4H
Uhlobo Lokuqhuba n-uhlobo

IMINININGWANE YEKHRISTAL YEKHWALITHI

6-intshi
Into Ibanga le-P-MOS Ibanga le-P-SBD
Ukungazweli 0.015Ω·cm-0.025Ω·cm
I-Polytype Akukho okuvunyelwe
I-Micropipe Density ≤0.2/cm2 ≤0.5/cm2
I-EPD ≤4000/cm2 ≤8000/cm2
I-TED ≤3000/cm2 ≤6000/cm2
I-BPD ≤1000/cm2 ≤2000/cm2
I-TSD ≤300/cm2 ≤1000/cm2
I-SF(Ikalwe nge-UV-PL-355nm) ≤0.5% indawo ≤1% indawo
Amapuleti e-Hex ngokukhanya okuphezulu kakhulu Akukho okuvunyelwe
I-Visual CarbonInclusions ngokukhanya okukhulu kakhulu Indawo eqoqekayo≤0.05%
微信截图_20240822105943

Ukungazweli

I-Polytype

6 lnch n-uhlobo lwe-sic substrate (3)
6 lnch n-uhlobo lwe-sic substrate (4)

I-BPD&TSD

6 lnch n-uhlobo lwe-sic substrate (5)
Ama-wafers e-SiC

  • Okwedlule:
  • Olandelayo: