Ukusika impahla ethuthukisiwe, imishini yokucubungula i-micro jet laser

Ukusika impahla ethuthukisiwe, okokusebenza kwe-micro jet laser processing Isithombe esifakiwe

Incazelo emfushane:

Ubuchwepheshe bethu bokusika i-microjet laser buqede ngempumelelo ukusika, ukusika nokusika kwe-silicon carbide ingot engu-6-intshi, kuyilapho ubuchwepheshe buhambisana nokusika nokusikwa kwamakristalu angu-8-intshi, angakwazi ukubona ukucutshungulwa kwe-monocrystalline silicon substrate ngokusebenza kahle okukhulu. , izinga eliphezulu, izindleko eziphansi, umonakalo ophansi kanye nesivuno esiphezulu.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

I-LASER MICROJET (LMJ)

I-laser beam egxilile ihlanganiswe nejethi lamanzi elinesivinini esikhulu, futhi induku yamandla enokusabalalisa okufanayo kwamandla esigaba esiphambanayo kwakheka ngemva kokuboniswa okugcwele odongeni lwangaphakathi lwekholomu yamanzi. Inezici zobubanzi bomugqa ophansi, ukuminyana kwamandla aphezulu, isiqondiso esilawulekayo kanye nokunciphisa isikhathi sangempela sokushisa kwendawo yezinto ezicutshungulwayo, okuhlinzeka ngezimo ezinhle kakhulu zokuqeda okudidiyelwe nokusebenza kahle kwezinto eziqinile neziqinile.

Ubuchwepheshe bemishini ye-laser micro-water jet machining busebenzisa ithuba lokwenzeka kokuboniswa okuphelele kwe-laser endaweni esibonakalayo yamanzi nomoya, ukuze i-laser ihlanganiswe ngaphakathi kwendiza yamanzi ezinzile, futhi kusetshenziswe amandla aphezulu ngaphakathi kwejethi yamanzi ukuze kuzuzwe. ukususwa kwezinto.

Imishini yokucubungula i-Microjet laser-2-3

UBUHLE BE-LASER MICROJET

Ubuchwepheshe be-Microjet laser (LMJ) busebenzisa umehluko wokusabalalisa phakathi kwezici zamanzi nezomoya ukuze kunqotshwe izinkinga ezingokwemvelo zokucutshungulwa kwe-laser evamile. Kulobu buchwepheshe, i-laser pulse ibonakala ngokugcwele kujethi lamanzi elihlanzekile elicutshungulwe ngendlela engaphazamiseki, njengoba ku-fiber optical.

Ngokombono wokusetshenziswa, izici eziyinhloko ze-LMJ microjet laser technology yilezi:

I-1, ugongolo lwe-laser luyi-cylindrical (parallel) laser beam;

2, i-laser pulse kujethi yamanzi njenge-fiber conduction, yonke inqubo ivikelekile kunoma yiziphi izici zemvelo;

I-3, i-laser beam igxile ngaphakathi kwemishini ye-LMJ, futhi alukho ushintsho ekuphakameni kwendawo eyenziwe ngomshini phakathi nayo yonke inqubo yokucubungula, ukuze asikho isidingo sokugxila ngokuqhubekayo phakathi nenqubo yokucubungula noshintsho ekujuleni kokucubungula. ;

4, ngaphezu kokukhishwa kwezinto ezicutshunguliwe ngesikhathi sokucutshungulwa kwe-laser pulse ngayinye, cishe u-99% wesikhathi ebangeni lesikhathi esisodwa kusukela ekuqaleni kokushaya ngakunye kuya ekucutshungulweni kwe-pulse elandelayo, impahla ecutshunguliwe ingokoqobo. -isikhathi sokupholisa amanzi, ukuze kucishe kuqedwe indawo ethinteke ukushisa kanye nongqimba lwe-remelt, kodwa kugcinwe ukusebenza kahle okuphezulu kokucubungula;

5, qhubeka nokuhlanza ubuso.

Ukubhala idivayisi

Lapho ukusika kwe-laser yendabuko, ukuqoqwa nokuqhutshwa kwamandla kuyimbangela eyinhloko yokulimala okushisayo ezinhlangothini zombili zendlela yokusika, futhi i-microjet laser, ngenxa yendima yekholomu yamanzi, izosusa ngokushesha ukushisa okusele kwe-pulse ngayinye. ngeke iqongelele ku-workpiece, ngakho-ke indlela yokusika ihlanzekile. Ngendlela yendabuko "yokusika okufihliwe" + "ukuhlukanisa", yehlisa ubuchwepheshe bokucubungula.