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Kungani Amadivayisi we-Semiconductor Adinga "I-Epitaxial Layer"
Umsuka Wegama elithi "Epitaxial Wafer" Ukulungiswa kwe-Wafer kuqukethe izinyathelo ezimbili eziyinhloko: ukulungiswa kwe-substrate kanye nenqubo ye-epitaxial. I-substrate yenziwe nge-semiconductor single crystal material futhi ivamise ukucutshungulwa ukuze kukhiqizwe amadivaysi e-semiconductor. Ingakwazi futhi ukwenza i-epitaxial pro...Funda kabanzi -
Iyini i-Silicon Nitride Ceramics?
Izitsha zobumba ze-Silicon nitride (Si₃N₄), njengezitsha zobumba ezithuthukisiwe, zinezinto ezinhle kakhulu ezifana nokumelana nezinga lokushisa eliphezulu, amandla aphezulu, ukuqina okuphezulu, ukuqina okuphezulu, ukumelana nokukhasa, ukumelana ne-oxidation, nokumelana nokugqokwa. Ukwengeza, banikeza okuhle ...Funda kabanzi -
I-SK Siltron ithola imali ebolekiwe engu-$544 million kwa-DOE ukuze andise ukukhiqizwa kwe-silicon carbide wafer
UMnyango Wezamandla wase-US (i-DOE) usanda kwamukela imali ebolekiwe engu-$544 million (okuhlanganisa namaRandi ayizigidi ezingu-481.5 kanye nenzalo ka-$62.5 wezigidi) ku-SK Siltron, umkhiqizi we-semiconductor wafer ngaphansi kwe-SK Group, ukuze asekele ukunwetshwa kwayo kwekhwalithi ephezulu ye-silicon carbide (SiC). ...Funda kabanzi -
Luyini uhlelo lwe-ALD(I-Atomic Layer Deposition)
I-Semicera ALD Susceptors: Ukunika amandla Ukubekwa Kwengqimba Ye-Atomic Ngokunemba Nokwethenjwa Kwe-Atomic Layer Deposition (ALD) kuyindlela esezingeni eliphezulu enikeza ukunemba kwesikali se-athomu sokufaka amafilimu azacile ezimbonini ezihlukahlukene zobuchwepheshe obuphezulu, okuhlanganisa izinto zikagesi, amandla,...Funda kabanzi -
Abasingathi Be-Semicera Bavakashela Kuklayenti Lemboni Ye-LED YaseJapane ukuze Babonise Ulayini Wokukhiqiza
I-Semicera iyakuthokozela ukumemezela ukuthi muva nje samukele ithimba elivela kumkhiqizi ohamba phambili wase-Japan we-LED ukuze avakashele umugqa wethu wokukhiqiza. Lokhu kuvakasha kugqamisa ubudlelwano obukhulayo phakathi kweSemicera kanye nemboni ye-LED, njengoba siqhubeka nokuhlinzeka ngezinga eliphezulu,...Funda kabanzi -
Ukuphela Komugqa (FEOL): Ukubeka Isisekelo
Ingaphambili, maphakathi nangemuva kwemigqa yokukhiqiza i-semiconductor Inqubo yokukhiqiza i-semiconductor ingahlukaniswa cishe izigaba ezintathu:1) Ingaphambili lomugqa2) Isiphetho esimaphakathi somugqa3) Isiphetho esingemuva somugqa Singasebenzisa isifaniso esilula njengokwakha indlu. ukuhlola inqubo eyinkimbinkimbi...Funda kabanzi -
Ingxoxo emfushane ngenqubo yokumboza i-photoresist
Izindlela zokumboza ze-photoresist zivame ukuhlukaniswa zibe i-spin coating, i-dip coating kanye ne-roll coating, phakathi kwayo i-spin coating isetshenziswa kakhulu. Ngokugcoba nge-spin, i-photoresist iconswa ku-substrate, futhi i-substrate ingazungeziswa ngesivinini esikhulu ukuze ifinyelele ...Funda kabanzi -
I-Photoresist: impahla ewumgogodla enezithiyo eziphezulu zokungena kuma-semiconductors
I-Photoresist okwamanje isetshenziswa kabanzi ekucubunguleni nasekukhiqizeni amasekhethi ezithombe ezinhle embonini yolwazi ye-optoelectronic. Izindleko zenqubo ye-photolithography zenza cishe u-35% wayo yonke inqubo yokukhiqiza ama-chip, futhi ukusetshenziswa kwesikhathi kubalwa ku-40% kuya ku-60...Funda kabanzi -
Ukungcoliswa kwendawo ye-wafer kanye nendlela yokutholwa kwayo
Ukuhlanzeka kwendawo eyi-wafer kuzothinta kakhulu izinga lokufaneleka lezinqubo nemikhiqizo elandelayo ye-semiconductor. Kufika ku-50% wakho konke ukulahlekelwa kwesivuno kubangelwa ukungcoliswa kwe-wafer surface. Izinto ezingabangela izinguquko ezingalawuleki endaweni kagesi...Funda kabanzi -
Ucwaningo ngenqubo ye-semiconductor die bonding kanye nemishini
Isifundo ngenqubo yokuhlanganisa i-semiconductor die, okuhlanganisa inqubo yokunamathisela enamathelayo, inqubo yokubopha i-eutectic, inqubo yebhondi ethambile ye-solder, inqubo ye-sintering yesiliva yebhondi, inqubo yokucindezela okushisayo, inqubo yokubopha ama-chip. Izinhlobo nezinkomba ezibalulekile zobuchwepheshe ...Funda kabanzi -
Funda mayelana ne-silicon nge-(TSV) nangengilazi nge-(TGV) ubuchwepheshe esihlokweni esisodwa
Ubuchwepheshe bokupakisha bungenye yezinqubo ezibaluleke kakhulu embonini ye-semiconductor. Ngokuvumelana nokuma kwephakheji, ingahlukaniswa ngephakheji yesokhethi, iphakethe le-surface Mount, iphakheji ye-BGA, iphakheji yosayizi we-chip (CSP), iphakheji ye-module ye-chip eyodwa (SCM, igebe phakathi kwezintambo ku ...Funda kabanzi -
Ukwenziwa Kwe-Chip: Izinsiza Zokuxhuma kanye Nenqubo
Enqubweni yokukhiqiza i-semiconductor, ubuchwepheshe be-etching yinqubo ebucayi esetshenziselwa ukususa izinto ezingafuneki ku-substrate ukuze kwakhiwe amaphethini esekethe ayinkimbinkimbi. Lo mbhalo uzokwethula ngokuningiliziwe ubuchwepheshe obubili bokuhlanganisa obujwayelekile - i-plasma ehlanganiswe ngamandla...Funda kabanzi