Amasu amanje okufakwa kwe-semiconductor ayathuthuka kancane kancane, kodwa izinga lapho okokusebenza okuzenzakalelayo nobuchwepheshe okwamukelwa khona ekufakweni kwe-semiconductor linquma ngokuqondile ukufezeka kwemiphumela elindelekile. Izinqubo ezikhona zokupakisha ze-semiconductor zisanenkinga yokungasebenzi kahle, futhi ochwepheshe bebhizinisi abakazisebenzisi ngokugcwele izinhlelo zemishini yokupakisha ezizenzakalelayo. Ngakho-ke, izinqubo zokupakisha ze-semiconductor ezingenakho ukusekelwa okuvela kubuchwepheshe bokulawula okuzenzakalelayo zizofaka izindleko eziphezulu zomsebenzi nesikhathi, okwenza kube nzima kochwepheshe ukulawula ngokuqinile ikhwalithi yokupakishwa kwe-semiconductor.
Enye yezindawo ezibalulekile okufanele zihlaziywe umthelela wezinqubo zokupakisha ekuthembekeni kwemikhiqizo ye-low-k. Ubuqotho bokuxhumana kwentambo yegolide ne-aluminium ehlanganisayo kuthintwa izici ezifana nesikhathi nezinga lokushisa, okubangela ukuthembeka kwayo kwehle ngokuhamba kwesikhathi futhi kubangele izinguquko esigabeni sayo samakhemikhali, okungase kuholele ekunciphiseni inqubo. Ngakho-ke, kubalulekile ukunaka ukulawulwa kwekhwalithi kuzo zonke izigaba zenqubo. Ukwakha amaqembu akhethekile omsebenzi ngamunye kungasiza ukuphatha lezi zinkinga ngokucophelela. Ukuqonda izimbangela zezinkinga ezivamile kanye nokuthuthukisa izixazululo ezihlosiwe, ezinokwethenjelwa kubalulekile ekugcineni ikhwalithi yenqubo yonke. Ikakhulukazi, izimo zokuqala zezintambo zokubopha, kufaka phakathi ama-bonding pads kanye nezinto eziyisisekelo kanye nezakhiwo, kufanele zihlaziywe ngokucophelela. Indawo yephedi yokubopha kufanele igcinwe ihlanzekile, futhi ukukhethwa kanye nokusetshenziswa kwezinto zocingo ezibophayo, amathuluzi okubopha, kanye nemingcele yokubopha kufanele kuhlangabezane nezidingo zenqubo ngokwezinga eliphezulu. Kutuswa ukuhlanganisa ubuchwepheshe benqubo yethusi ye-k ne-fine-pitch bonding ukuze kuqinisekiswe ukuthi umthelela we-Gold-aluminium IMC ekuthembekeni kwephakheji ugqanyiswa kakhulu. Ngezintambo zokubopha ezinephimbo elihle, noma yikuphi ukuguquguquka kungathinta usayizi wamabhola wokubopha futhi kukhawulele indawo ye-IMC. Ngakho-ke, ukulawulwa kwekhwalithi okuqinile ngesikhathi sesigaba esisebenzayo kuyadingeka, ngamathimba nabasebenzi bahlola ngokucophelela imisebenzi yabo ethile kanye nezibopho zabo, belandela izidingo zenqubo kanye nezinkambiso zokuxazulula izinkinga eziningi.
Ukuqaliswa okuphelele kokupakishwa kwe-semiconductor kunomsebenzi wobuchwepheshe. Ochwepheshe bebhizinisi kufanele balandele ngokuqinile izinyathelo zokusebenza zokupakishwa kwe-semiconductor ukuze baphathe izingxenye ngendlela efanele. Kodwa-ke, abanye abasebenzi bebhizinisi abawasebenzisi amasu ajwayelekile ukuze baqedele inqubo yokupakisha ye-semiconductor futhi badebeselele nokuqinisekisa ukucaciswa namamodeli wezingxenye ze-semiconductor. Ngenxa yalokho, ezinye izingxenye ze-semiconductor zipakishwe ngokungalungile, zivimbela i-semiconductor ekwenzeni imisebenzi yayo eyisisekelo futhi ithinte izinzuzo zezomnotho zebhizinisi.
Sekukonke, izinga lobuchwepheshe lokupakishwa kwe-semiconductor lisadinga ukuthuthuka ngokuhlelekile. Ochwepheshe emabhizinisini akhiqiza ama-semiconductor kufanele basebenzise kahle izinhlelo zemishini yokupakisha ezizenzakalelayo ukuze baqinisekise ukuhlangana okulungile kwazo zonke izingxenye ze-semiconductor. Abahloli bekhwalithi kufanele benze ukubuyekezwa okuphelele nokuqinile ukuze bahlonze ngokunembile amadivaysi e-semiconductor apakishwe ngokungalungile futhi banxuse ochwepheshe ngokushesha ukuthi benze izilungiso ezisebenzayo.
Ngaphezu kwalokho, kumongo wokulawulwa kwekhwalithi yenqubo yokuhlanganisa izintambo, ukusebenzisana phakathi kongqimba lwensimbi kanye nongqimba lwe-ILD endaweni yokubopha ucingo kungaholela ekudambisweni, ikakhulukazi lapho i-pad yokubopha ucingo kanye nongqimba olungaphansi lwensimbi/ILD luguquguquka lube umumo wenkomishi. . Lokhu kubangelwa ikakhulukazi ukucindezela namandla e-ultrasonic asetshenziswa umshini wokuhlanganisa ucingo, onciphisa kancane kancane amandla e-ultrasonic futhi uwadlulisele endaweni yokuhlanganisa ucingo, okuvimbela ukusakazeka okuhlangene kwegolide ne-athomu ye-aluminium. Esigabeni sokuqala, ukuhlolwa kwe-low-k chip wire bonding kuveza ukuthi amapharamitha enqubo yokubopha azwela kakhulu. Uma amapharamitha wokubopha esethwe aphansi kakhulu, izinkinga ezifana nokunqamuka kwezintambo namabhondi abuthaka zingase ziphakame. Ukwandisa amandla e-ultrasonic ukunxephezela lokhu kungaholela ekulahlekelweni kwamandla futhi kubhebhethekise ukuwohloka okumise okwenkomishi. Ukwengeza, ukunamathela okubuthakathaka phakathi kwesendlalelo se-ILD kanye nongqimba lwensimbi, kanye nokuqina kwezinto ezi-low-k, yizizathu eziyinhloko zokuchithwa kwesendlalelo sensimbi kusuka kungqimba lwe-ILD. Lezi zici ziphakathi kwezinselelo eziyinhloko ekulawuleni ikhwalithi yenqubo yokupakisha ye-semiconductor kanye nokusungula izinto ezintsha.
Isikhathi sokuthumela: May-22-2024