Ukuphela komugqa wokukhiqiza kufana nokubeka isisekelo nokwakha izindonga zendlu. Ekwenziweni kwe-semiconductor, lesi sigaba sibandakanya ukudala izakhiwo eziyisisekelo nama-transistors ku-wafer ye-silicon.
Izinyathelo ezibalulekile ze-FEOL:
1. Ukuhlanza:Qala nge-wafer encane ye-silicon futhi uyihlanze ukuze ususe noma yikuphi ukungcola.
2. I-Oxidation:Khulisa ungqimba lwe-silicon dioxide ku-wafer ukuze uhlukanise izingxenye ezahlukene ze-chip.
3. I-Photolithography:Sebenzisa i-photolithography ukuze unamathisele amaphethini ku-wafer, efana nokudweba amapulani ngokukhanya.
4. Etching:Khipha i-silicon dioxide engafuneki ukuze uveze amaphethini oyifunayo.
5. I-Doping:Ngenisa ukungcola ku-silicon ukuze uguqule izici zayo zikagesi, udale ama-transistors, amabhlogo wokwakha ayisisekelo anoma iyiphi i-chip.
I-Mid End of Line (MEOL): Ukuxhuma Amachashazi
Ukuphela komugqa wokukhiqiza kufana nokufaka izintambo namapayipi endlini. Lesi sigaba sigxile ekusunguleni ukuxhumana phakathi kwama-transistors adalwe esigabeni se-FEOL.
Izinyathelo ezibalulekile ze-MEOL:
1. I-Dielectric Deposition:Idiphozithi izendlalelo zokuvikela (ezibizwa ngokuthi ama-dielectrics) ukuvikela ama-transistors.
2. Ukwakhiwa Kokuxhumana:Yenza othintana nabo ukuze uxhume ama-transistors komunye nomunye nasemhlabeni wangaphandle.
3. Xhumanisa:Engeza izendlalelo zensimbi ukuze udale izindlela zamasiginali kagesi, okufana nokufaka izintambo endlini ukuze uqinisekise amandla angenamthungo nokugeleza kwedatha.
Ukuphela Kwasemuva Komugqa (BEOL): Ukuqeda Ukuthinta
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Ingemuva lomugqa wokukhiqiza lifana nokwengeza ukuthinta kokugcina endlini—ukufaka izinto ezilungiswayo, ukupenda, nokuqinisekisa ukuthi yonke into iyasebenza. Ekwenziweni kwe-semiconductor, lesi sigaba sifaka ukufaka izendlalelo zokugcina nokulungisa i-chip ukuze ifakwe.
Izinyathelo ezibalulekile ze-BEOL:
1. Izendlalelo Zensimbi Ezengeziwe:Engeza izendlalelo zensimbi eziningi ukuze uthuthukise ukuxhumana, uqinisekise ukuthi i-chip ingakwazi ukuphatha imisebenzi eyinkimbinkimbi nesivinini esiphezulu.
2. Intshisekelo:Faka izendlalelo zokuvikela ukuze uvikele i-chip ekulimaleni kwemvelo.
3. Ukuhlola:Faka i-chip ekuhlolweni okuqinile ukuze uqiniseke ukuthi ihlangabezana nakho konke ukucaciswa.
4. Ukudayela:Sika i-wafer ibe ama-chips ngamanye, ngalinye lilungele ukupakishwa futhi lisetshenziswe kumishini kagesi.
Isikhathi sokuthumela: Jul-08-2024