Ukuphela Komugqa (FEOL): Ukubeka Isisekelo

Iziphetho zangaphambili, eziphakathi nangemuva zemigqa yokukhiqiza ye-semiconductor

Inqubo yokukhiqiza i-semiconductor ingahlukaniswa izigaba ezintathu:
1) Ngaphambili komugqa
2) Ekupheleni komugqa
3) Ngemuva komugqa

Singasebenzisa isifaniso esilula njengokwakha indlu ukuze sihlole inqubo eyinkimbinkimbi yokwenziwa kwama-chip:

Ukuphela komugqa wokukhiqiza kufana nokubeka isisekelo nokwakha izindonga zendlu. Ekwenziweni kwe-semiconductor, lesi sigaba sibandakanya ukudala izakhiwo eziyisisekelo nama-transistors ku-wafer ye-silicon.

Izinyathelo ezibalulekile ze-FEOL:

1.Ukuhlanza: Qala nge-silicon wafer encane futhi uyihlanze ukuze ususe noma yikuphi ukungcola.
2.I-Oxidation: Khulisa ungqimba lwe-silicon dioxide ku-wafer ukuze uhlukanise izingxenye ezahlukene ze-chip.
3.I-Photolithography: Sebenzisa i-photolithography ukuze unamathisele amaphethini ku-wafer, efana nokudweba amapulani ngokukhanya.
4.Etching: Khipha i-silicon dioxide engafuneki ukuze uveze amaphethini oyifunayo.
5.I-Doping: Yethula ukungcola ku-silicon ukuze uguqule izakhiwo zayo zikagesi, udale ama-transistors, amabhlogo wokwakha ayisisekelo anoma iyiphi i-chip.

I-Mid End of Line (MEOL): Ukuxhuma Amachashazi

Ukuphela komugqa wokukhiqiza kufana nokufaka izintambo namapayipi endlini. Lesi sigaba sigxile ekusunguleni ukuxhumana phakathi kwama-transistors adalwe esigabeni se-FEOL.

Izinyathelo ezibalulekile ze-MEOL:

I-1.I-Dielectric Deposition: Idiphozithi ye-insulating layers (ebizwa ngokuthi i-dielectrics) ukuvikela ama-transistors.
I-2.Ukwakhiwa Kokuxhumana: Yenza othintana nabo ukuze uxhume ama-transistors komunye nomunye nasemhlabeni wangaphandle.
3.I-Interconnect: Engeza izendlalelo zensimbi ukuze udale izindlela zamasignali kagesi, okufana nokufaka izintambo endlini ukuze uqinisekise amandla angenamthungo nokugeleza kwedatha.

Ukuphela Kwasemuva Komugqa (BEOL): Ukuqeda Ukuthinta

Ingemuva lomugqa wokukhiqiza lifana nokwengeza ukuthinta kokugcina endlini—ukufaka izinto ezilungiswayo, ukupenda, nokuqinisekisa ukuthi yonke into iyasebenza. Ekwenziweni kwe-semiconductor, lesi sigaba sifaka ukufaka izendlalelo zokugcina nokulungisa i-chip ukuze ifakwe.

Izinyathelo ezibalulekile ze-BEOL:

I-1.Izendlalelo Zensimbi Ezengeziwe: Engeza izendlalelo zensimbi eziningi ukuze uthuthukise ukuxhumana, uqinisekise ukuthi i-chip ingakwazi ukusingatha imisebenzi eyinkimbinkimbi kanye nesivinini esiphezulu.
2.I-Passivation: Faka izendlalelo zokuvikela ukuze uvikele i-chip ekulimaleni kwemvelo.
3.Ukuhlola: Faka i-chip ekuhlolweni okuqinile ukuze kuqinisekiswe ukuthi ihlangabezana nakho konke ukucaciswa.
4.I-Dicing: Sika i-wafer ibe ama-chips angawodwana, ngalinye lilungele ukupakishwa futhi lisetshenziswe kumishini kagesi.

I-Semicera ingumkhiqizi we-OEM ohamba phambili e-China, ozinikele ekunikezeni inani eliyingqayizivele kumakhasimende ethu. Sinikeza uhla oluphelele lwemikhiqizo namasevisi ekhwalithi ephezulu, okuhlanganisa:

1.I-CVD SiC Coating(I-Epitaxy, izingxenye ezimbozwe nge-CVD ngokwezifiso, okokusebenza okuphezulu kwezinhlelo zokusebenza ze-semiconductor, nokuningi)
2.Izingxenye ze-CVD SiC Bulk(Etch rings, focus rings, custom SiC components for semiconductor equipment, nokunye)
3.Izingxenye Ezihlanganisiwe ze-CVD TaC(I-Epitaxy, ukukhula kwe-SiC wafer, izinhlelo zokusebenza ezishisa kakhulu, nokuningi)
4.Izingxenye zeGraphite(Izikebhe ze-graphite, izingxenye ze-graphite zangokwezifiso zokucubungula izinga lokushisa eliphezulu, nokuningi)
5.Izingxenye ze-SiC(Izikebhe ze-SiC, amashubhu esithandweni se-SiC, izingxenye ze-SiC zangokwezifiso zokucubungula izinto ezithuthukisiwe, nokuningi)
6.Izingxenye ze-Quartz(Izikebhe ze-quartz, izingxenye ze-quartz zangokwezifiso ze-semiconductor nezimboni zelanga, nokuningi)

Ukuzibophezela kwethu ekwenzeni kahle kuqinisekisa ukuthi sihlinzeka ngezixazululo ezintsha nezithembekile ezimbonini ezihlukahlukene, okuhlanganisa ukukhiqiza ama-semiconductor, ukucubungula izinto ezithuthukisiwe, kanye nezicelo zobuchwepheshe obuphezulu. Ngokugxila ekunembeni nekhwalithi, sizinikele ekuhlangabezaneni nezidingo ezihlukile zekhasimende ngalinye.