Ukufunda nge-semiconductor kuyafainqubo yokuhlanganisa, okuhlanganisa inqubo yokuhlanganisa okunamathelayo, inqubo yokuhlanganisa i-eutectic, inqubo yokubopha i-solder ethambile, inqubo ye-sintering sintering bonding, inqubo yokucindezela okushisayo, inqubo ye-flip chip bonding. Izinhlobo nezinkomba ezibalulekile zobuchwepheshe zemishini ye-semiconductor die bonding ziyethulwa, isimo sokuthuthuka siyahlaziywa, futhi kulindelwe inkambiso yentuthuko.
1 Uhlolojikelele lwemboni ye-semiconductor kanye nokupakishwa
Imboni ye-semiconductor ikakhulukazi ihlanganisa izinto zokwakha kanye nemishini ye-semiconductor ekhuphukayo, ukukhiqizwa kwe-semiconductor ephakathi nendawo, kanye nezinhlelo zokusebenza ezingezansi. imboni yezwe lami ye-semiconductor yaqala sekwephuzile, kodwa ngemva kweminyaka ecishe ibe yishumi yentuthuko esheshayo, izwe lami seliphenduke imakethe yabathengi yomkhiqizo omkhulu kunawo wonke emhlabeni kanye nemakethe enkulu kunazo zonke emhlabeni yemishini ye-semiconductor. Imboni ye-semiconductor ibilokhu ithuthuka ngokushesha ngendlela yesizukulwane esisodwa semishini, isizukulwane esisodwa senqubo, kanye nesizukulwane esisodwa semikhiqizo. Ucwaningo ngenqubo ye-semiconductor kanye nemishini ingamandla okuqhuba inqubekelaphambili eqhubekayo yemboni kanye nesiqinisekiso sokusungulwa kwezimboni nokukhiqizwa ngobuningi kwemikhiqizo ye-semiconductor.
Umlando wokuthuthuka wobuchwepheshe bokupakisha be-semiconductor umlando wokuthuthukiswa okuqhubekayo kokusebenza kwe-chip kanye nokwenza kancane kancane kwezinhlelo. Amandla okushayela angaphakathi obuchwepheshe bokupakisha ashintshile kusukela emkhakheni wama-smartphones asezingeni eliphezulu kuya emikhakheni efana nekhompyutha esebenza kahle kakhulu kanye nobuhlakani bokwenziwa. Izigaba ezine zokuthuthukiswa kobuchwepheshe bokupakisha be-semiconductor ziboniswa kuThebula 1.
Njengoba ama-semiconductor lithography process node eqhubekela ku-10 nm, 7 nm, 5 nm, 3 nm, no-2 nm, i-R&D nezindleko zokukhiqiza ziyaqhubeka nokukhuphuka, izinga lokukhiqiza liyehla, futhi uMthetho kaMoore wehla. Ngokombono wezitayela zokuthuthukiswa kwezimboni, okwamanje ezivinjelwa imikhawulo ebonakalayo ye-transistor density kanye nokwenyuka okukhulu kwezindleko zokukhiqiza, ukupakishwa kuthuthukiswa kubhekiselwa ku-miniaturization, ukuminyana okuphezulu, ukusebenza okuphezulu, isivinini esikhulu, imvamisa ephezulu, kanye nokuhlanganiswa okuphezulu. Imboni ye-semiconductor isingene enkathini ye-post-Moore, futhi izinqubo ezithuthukisiwe azisagxilile nje ekuthuthukisweni kwezindawo zobuchwepheshe bokukhiqiza ama-wafer, kodwa kancane kancane ziphendukela kubuchwepheshe bokupakisha obuphambili. Ubuchwepheshe bokupakisha obuthuthukisiwe abukwazi nje ukuthuthukisa imisebenzi nokwandisa inani lomkhiqizo, kodwa futhi bunciphise ngempumelelo izindleko zokukhiqiza, bube yindlela ebalulekile yokuqhubeka noMthetho kaMoore. Ngakolunye uhlangothi, ubuchwepheshe bezinhlayiya eziyinhloko busetshenziselwa ukuhlukanisa izinhlelo eziyinkimbinkimbi zibe ubuchwepheshe bokupakisha obuningana obungahlanganiswa emaphaketheni ahlukahlukene futhi ahlukahlukene. Ngakolunye uhlangothi, ubuchwepheshe besistimu ehlanganisiwe busetshenziselwa ukuhlanganisa amadivaysi ezinto ezahlukene kanye nezakhiwo, ezinezinzuzo eziyingqayizivele zokusebenza. Ukuhlanganiswa kwemisebenzi eminingi kanye namadivayisi wezinto ezihlukene kwenziwa ngokusebenzisa ubuchwepheshe be-microelectronics, futhi ukuthuthukiswa kusuka kumasekethe ahlanganisiwe kuya kumasistimu ahlanganisiwe kuyenziwa.
Ukupakishwa kwe-semiconductor kuyisiqalo sokukhiqizwa kwe-chip kanye nebhuloho phakathi kwezwe langaphakathi le-chip nohlelo lwangaphandle. Njengamanje, ngaphezu kwezinkampani zendabuko zokupakisha nokuhlola ze-semiconductor, i-semiconductorisilucwecwanaama-Foundries, izinkampani zokuklama ama-semiconductor, nezinkampani zezingxenye ezididiyelwe zithuthukisa ngenkuthalo ukupakishwa okuthuthukile noma ubuchwepheshe bokupakisha obubalulekile obuhlobene.
Izinqubo eziyinhloko zobuchwepheshe bokupakisha bendabuko ziyiisilucwecwanaUkunciphisa, ukusika, i-die bonding, i-wire bonding, ukufaka uphawu kwepulasitiki, i-electroplating, ukusika izimbambo nokubumba, njll. Phakathi kwazo, inqubo yokuhlanganisa i-die ingenye yezinqubo zokupakisha eziyinkimbinkimbi kakhulu futhi ezibucayi, futhi imishini yenqubo yokuhlanganisa i-die nayo ingenye imishini esemqoka ebaluleke kakhulu ekufakweni kwe-semiconductor, futhi ingenye yemishini yokupakisha enenani eliphakeme kakhulu lemakethe. Nakuba ubuchwepheshe bokupakisha obuthuthukisiwe busebenzisa izinqubo zangaphambili ezifana ne-lithography, i-etching, i-metallization, kanye ne-planarization, inqubo yokupakisha ebaluleke kakhulu kuseyinqubo yokuhlanganisa ukufa.
2 Inqubo yokuhlanganisa i-Semiconductor die
2.1 Uhlolojikelele
Inqubo ye-die bonding ibizwa nangokuthi i-chip loading, i-core loading, i-die bonding, inqubo ye-chip bonding, njll. Inqubo ye-die bonding iboniswa kuMfanekiso 1. Ngokuvamile, i-die bonding iwukuthatha i-chip ku-wafer usebenzisa ikhanda lokushisela. umbhobho wokumunca usebenzisa i-vacuum, futhi uyibeke endaweni ekhethiwe yephedi yohlaka oluholayo noma i-substrate yokupakisha ngaphansi kokuqondisa okubonakalayo, ukuze i-chip nephedi kuboshwe futhi kulungisiwe. Izinga nokusebenza kahle kwenqubo ye-die bonding kuzothinta ngokuqondile ikhwalithi nokusebenza kahle kwe-wire bonding elandelayo, ngakho-ke i-die bonding ingenye yobuchwepheshe obuyinhloko kunqubo yokuphela kwe-semiconductor.
Ezinqubweni ezihlukene zokupakisha umkhiqizo we-semiconductor, okwamanje kukhona ubuchwepheshe benqubo ye-die bonding eyinhloko, okuyi-adhesive bonding, i-eutectic bonding, i-solder bonding ethambile, i-sintering bonding eyisiliva, i-hot pressing bonding, kanye ne-flip-chip bonding. Ukuze kuzuzwe okuhle kwe-chip bonding, kuyadingeka ukwenza izakhi zenqubo eziyinhloko enqubweni yokubopha i-die zisebenzisane, ikakhulukazi kufaka phakathi izinto zokubopha ukufa, izinga lokushisa, isikhathi, ingcindezi nezinye izakhi.
2. 2 Inqubo yokuhlanganisa okunamathelayo
Phakathi ne-adhesive bonding, inani elithile lokunamathisela lidinga ukufakwa kuhlaka lokuhola noma i-substrate yephakheji ngaphambi kokubeka i-chip, bese ikhanda elibophayo lithatha i-chip, futhi ngokuqondiswa kombono womshini, i-chip ibekwe ngokunembile ekubopheni. indawo yohlaka lomthofu noma i-substrate yephakeji enamathiselwe nge-adhesive, futhi amandla athile okubopha okufa asetshenziswa ku-chip ngekhanda lomshini wokuhlanganisa i-die, okwenza ungqimba olunamathelayo phakathi kwe-chip ne-chip. ifreyimu eholayo noma i-substrate yephakheji, ukuze kuzuzwe inhloso yokubopha, ukufaka nokulungisa i-chip. Le nqubo ye-die bonding ibizwa nangokuthi inqubo ye-glue bonding ngoba i-adhesive idinga ukufakwa phambi komshini we-die bonding.
Izinamatheliso ezisetshenziswa kakhulu zifaka izinto ezisetshenziswa yi-semiconductor njenge-epoxy resin kanye ne-conductive silver paste. I-Adhesive bonding iyinqubo esetshenziswa kakhulu kunazo zonke ye-semiconductor chip die bonding ngoba inqubo ilula, izindleko ziphansi, futhi izinhlobonhlobo zezinto zingasetshenziswa.
2.3 Inqubo yokuhlanganisa i-Eutectic
Phakathi ne-eutectic bonding, impahla ye-eutectic bonding ngokuvamile isetshenziswa ngaphambili phansi kwe-chip noma uhlaka oluholayo. Imishini ye-eutectic bonding ithatha i-chip futhi iqondiswa isistimu yombono womshini ukuze ibeke ngokunembile i-chip endaweni ehambisanayo yokubopha yozimele wokuhola. I-chip nohlaka oluholayo lwakha isixhumi esibonakalayo se-eutectic bonding phakathi kwe-chip ne-substrate yephakheji ngaphansi kwesenzo esihlanganisiwe sokushisisa nokucindezela. Inqubo ye-eutectic bonding ivamise ukusetshenziswa kuhlaka lomthofu kanye nokupakishwa kwe-ceramic substrate.
Izinto zokuhlanganisa i-Eutectic ngokuvamile zixutshwa izinto ezimbili ezingeni lokushisa elithile. Izinto ezisetshenziswa kakhulu zifaka igolide nethini, igolide ne-silicon, njll. Uma usebenzisa inqubo ye-eutectic bonding, imojula yokudlulisa ithrekhi lapho uhlaka lomthofu lukhona izoshisa ngaphambili uhlaka. Isihluthulelo sokufezeka kwenqubo ye-eutectic bonding ukuthi i-eutectic bonding material ingancibilika ezingeni lokushisa elingaphansi kakhulu kwephoyinti lokuncibilika lezinto ezimbili ezihlanganisayo ukuze zakhe ibhondi. Ukuze uvimbele uhlaka ukuthi lufakwe i-oxid ngesikhathi senqubo ye-eutectic bonding, inqubo ye-eutectic bonding futhi ivamise ukusebenzisa amagesi avikelayo afana ne-hydrogen negesi exutshwe ne-nitrogen ukuze kufakwe ithrekhi ukuze kuvikelwe uhlaka oluholayo.
2. 4 Inqubo yokuhlanganisa i-solder ethambile
Uma i-solder ethambile ibonding, ngaphambi kokubeka i-chip, indawo yokubopha kufreyimu eholayo iyathinwa futhi icindezelwe, noma ifakwe kabili, futhi ifreyimu yokuhola idinga ukushiswa kuthrekhi. Inzuzo yenqubo yokuhlanganisa i-solder ethambile iyi-conductivity enhle ye-thermal, futhi okubi ukuthi kulula ukwenza i-oxidize futhi inqubo iyinkimbinkimbi ngokuqhathaniswa. Ilungele ukupakishwa kohlaka oluholayo lwamadivayisi kagesi, afana nokupakishwa kohlaka lwe-transistor.
2. 5 Inqubo yokuhlanganisa isiliva yesiliva
Inqubo ethembisa kakhulu yokuhlanganisa ye-chip yamanje yesizukulwane sesithathu yamandla e-semiconductor ukusebenzisa ubuchwepheshe bezinhlayiyana zensimbi, obuxuba ama-polymers njenge-epoxy resin enesibopho sokuxhuma ku-glue conductive. Ine-conductivity kagesi enhle kakhulu, i-thermal conductivity, kanye nezici zesevisi yezinga eliphezulu lokushisa. Kubuye kube ubuchwepheshe obubalulekile bokuthuthuka okuqhubekayo ekufakweni kwe-semiconductor yesizukulwane sesithathu eminyakeni yakamuva.
2.6 Inqubo yokuhlanganisa i-Thermocompression
Ekufakweni kokupakishwa kwamasekethe ahlanganisiwe anezinhlangothi ezintathu ezisebenza kahle kakhulu, ngenxa yokuncishiswa okuqhubekayo kwe-chip interconnect input/output, usayizi weqhubu kanye nephimbo, inkampani ye-semiconductor i-Intel yethule inqubo yokubopha i-thermocompression yezinhlelo zokusebenza ezithuthukisiwe ze-pitch bonding, ukubopha okuncane. ama-bump chips ane-pitch engu-40 kuya ku-50 μm noma ngisho no-10 μm. Inqubo yokuhlanganisa i-Thermocompression ifanele izinhlelo zokusebenza ze-chip-to-wafer kanye ne-chip-to-substrate. Njengenqubo yezinyathelo eziningi esheshayo, inqubo ye-thermocompression bonding ibhekana nezinselele ezindabeni zokulawula inqubo, njengezinga lokushisa elingalingani kanye nokuncibilika okungalawuleki kwe-solder yevolumu encane. Ngesikhathi se-thermocompression bonding, izinga lokushisa, ingcindezi, isikhundla, njll. kumele kuhlangabezane nezidingo zokulawula ezinembile.
2.7 Flip chip bonding inqubo
Umgomo wenqubo ye-flip chip bonding uboniswa kuMfanekiso 2. I-flip mechanism icosha chip ku-wafer futhi iyiphenye ngo-180° ukuze idlulise i-chip. I-solderhead nozzle iphakamisa i-chip kumshini wokuphehla, futhi i-bump direction ye-chip ibheke phansi. Ngemuva kokuthi umlomo wombhobho wekhanda lokushisela udlulele phezulu kwe-substrate yokupakisha, iya phansi ukuze ibophe futhi ilungise i-chip ku-substrate yokupakisha.
I-Flip chip packaging iwubuchwepheshe obuphambili bokuxhumanisa ama-chip futhi isiphenduke inkomba eyinhloko yokuthuthukiswa kobuchwepheshe bokupakisha obuthuthukile. Inezici zokuminyana okuphezulu, ukusebenza okuphezulu, izacile futhi kufushane, futhi ingahlangabezana nezidingo zokuthuthukiswa kwemikhiqizo ye-elekthronikhi yabathengi efana nama-smartphone namaphilisi. Inqubo ye-flip chip bonding yenza izindleko zokupakisha zehle futhi ikwazi ukubona ama-chips astakiwe kanye nokupakishwa kwezinhlangothi ezintathu. Isetshenziswa kakhulu emikhakheni yobuchwepheshe bokupakisha efana nokupakishwa okuhlanganisiwe kwe-2.5D/3D, ukupakishwa kwezinga le-wafer, kanye nokupakishwa kwezinga lesistimu. Inqubo ye-flip chip bonding iyinqubo esetshenziswa kakhulu futhi esetshenziswa kabanzi kakhulu ye-solid die bonding kubuchwepheshe bokupakisha obuphambili.
Isikhathi sokuthumela: Nov-18-2024