Ukuhlanzeka kwei-wafer surfaceizothinta kakhulu izinga lokufaneleka lezinqubo nemikhiqizo elandelayo ye-semiconductor. Kufika ku-50% wakho konke ukulahlekelwa kwesivuno kubangelwai-wafer surfaceukungcola.
Izinto ezingabangela izinguquko ezingalawuleki ekusebenzeni kukagesi ocingweni noma inqubo yokukhiqiza idivayisi ngokuqoqiwe kubizwa ngokuthi ukungcola. Ukungcola kungase kuvele ku-wafer ngokwayo, igumbi elihlanzekile, amathuluzi okucubungula, amakhemikhali okucubungula noma amanzi.I-waferukungcola ngokuvamile kungatholwa ngokubheka okubonakalayo, ukuhlolwa kwenqubo, noma ukusetshenziswa kwezinto eziyinkimbinkimbi zokuhlaziya ekuhlolweni kokugcina kwedivayisi.
▲Ukungcola okungaphezulu kwamawafa e-silicon | Inethiwekhi yomthombo wesithombe
Imiphumela yokuhlaziywa kokungcola ingasetshenziswa ukukhombisa izinga kanye nohlobo lokungcola okuhlangatshezwe yi-isilucwecwanaesinyathelweni senqubo ethile, umshini othile noma inqubo iyonke. Ngokuhlukaniswa kwezindlela zokutholwa,i-wafer surfaceukungcola kungahlukaniswa ngezinhlobo ezilandelayo.
Ukungcoliswa kwensimbi
Ukungcoliswa okubangelwa izinsimbi kungabangela ukukhubazeka kwedivayisi ye-semiconductor ngamazinga ahlukahlukene.
Izinsimbi ze-alkali noma izinsimbi zomhlaba ezine-alkaline (Li, Na, K, Ca, Mg, Ba, njll.) zingabangela ukuvuza kwamanje esakhiweni se-pn, okubuye kuholele ku-voltage yokuwohloka kwe-oxide; inguquko yensimbi nensimbi esindayo (Fe, Cr, Ni, Cu, Au, Mn, Pb, njll.) ukungcola kunganciphisa umjikelezo wempilo yenkampani yenethiwekhi, kunciphise impilo yesevisi yengxenye noma kukhuphule umbane omnyama lapho ingxenye isebenza.
Izindlela ezivamile zokuthola ukungcoliswa kwensimbi ukuboniswa okuphelele kwe-X-ray fluorescence, i-atomic absorption spectroscopy kanye ne-inductively coupled plasma mass spectrometry (ICP-MS).
▲ Ukungcoliswa kwendawo ye-wafer | ResearchGate
Ukungcoliswa kwensimbi kungase kuqhamuke ezintweni ezisetshenziswayo ekuhlanzeni, ekufakeni, ekufakeni i-lithography, ekufakweni, njll., noma emishinini esetshenziswa kule nqubo, efana nohhavini, ama-reactors, ukufakwa kwama-ion, njll., noma kungase kubangelwe ukuphatha ama-wafer budedengu.
Ukungcoliswa kwezinhlayiya
Amadiphozithi angempela ezinto ngokuvamile abonwa ngokuthola ukukhanya okuhlakazekile kusuka kokonakala kwendawo. Ngakho-ke, igama lesayensi elinembe kakhudlwana lokungcoliswa kwezinhlayiyana i-light-point defect. Ukungcoliswa kwezinhlayiya kungabangela ukuvinjwa noma ukufihla imiphumela kuzinqubo ze-etching kanye ne-lithography.
Ngesikhathi sokukhula kwefilimu noma ukufakwa, amaphinikhodi nama-microvoid akhiqizwa, futhi uma izinhlayiya zinkulu futhi ziqhuba, zingabangela ngisho namasekhethi amafushane.
▲ Ukwakheka kokungcoliswa kwezinhlayiyana | Inethiwekhi yomthombo wesithombe
Ukungcoliswa kwezinhlayiyana ezincane kungabangela izithunzi ebusweni, njengalapho i-photolithography. Uma izinhlayiya ezinkulu zitholakala phakathi kwe-photomask nesendlalelo se-photoresist, zinganciphisa ukulungiswa kokuchayeka kokuxhumana.
Ngaphezu kwalokho, bangakwazi ukuvimba ama-ion asheshayo ngesikhathi sokufakelwa kwe-ion noma i-etching eyomile. Izinhlayiya zingabuye zivalwe yifilimu, ukuze kube namaqhubu namaqhubu. Izendlalelo ezifakwe kamuva zingase ziqhekeke noma zimelane nokunqwabelana kulezi zindawo, kubangele izinkinga ngesikhathi sokuchayeka.
Ukungcola okuphilayo
Ukungcola okuqukethe ikhabhoni, kanye nezakhiwo zokubopha ezihlotshaniswa no-C, kubizwa ngokuthi ukungcoliswa kwezinto eziphilayo. Ukungcola kwe-Organic kungase kubangele izakhiwo ze-hydrophobic ezingalindelekile ku-i-wafer surface, ukwandisa ukukhahlamezeka kwendawo, ukukhiqiza indawo ene-hazy, ukuphazamisa ukukhula kongqimba lwe-epitaxial, futhi kuthinte umphumela wokuhlanza wokungcoliswa kwensimbi uma ukungcola kungasuswa kuqala.
Ukungcoliswa komhlaba okunjalo ngokuvamile kutholwa amathuluzi afana ne-thermal desorption MS, i-X-ray photoelectron spectroscopy, kanye ne-Auger electron spectroscopy.
▲Inethiwekhi yomthombo wesithombe
Ukungcoliswa kwegesi kanye nokungcoliswa kwamanzi
Ama-athomu asemkhathini nokungcoliswa kwamanzi anosayizi wamangqamuzana ngokuvamile awasuswa umoya osebenza kahle kakhulu we-particulate air (HEPA) noma izihlungi zomoya ze-ultra-low penetration (ULPA). Ukungcola okunjalo kuvame ukugadwa yi-ion mass spectrometry kanye ne-capillary electrophoresis.
Okunye ukungcola kungase kube ngokwezigaba eziningi, isibonelo, izinhlayiya zingase zenziwe ngezinto eziphilayo noma zensimbi, noma zombili, ngakho lolu hlobo lokungcola lungabuye lubekwe njengezinye izinhlobo.
▲Ukungcola kwamangqamuzana kagesi | I-IONCON
Ngaphezu kwalokho, ukungcoliswa kwe-wafer kungabuye kufakwe kusigaba njengokungcoliswa kwamangqamuzana, ukungcoliswa kwezinhlayiyana, kanye nokungcoliswa kwemfucumfucu okususelwa kunqubo ngokuya ngobukhulu bomthombo wokungcoliswa. Ubukhulu bezinhlayiyana zokungcola buncane, kuba nzima nakakhulu ukususa. Ekukhiqizweni kwengxenye ye-elekthronikhi yanamuhla, izinqubo zokuhlanza ama-wafer zenza ama-30% - 40% ayo yonke inqubo yokukhiqiza.
▲Ukungcola okungaphezulu kwamawafa e-silicon | Inethiwekhi yomthombo wesithombe
Isikhathi sokuthumela: Nov-18-2024