Yiziphi izinyathelo eziyinhloko ekucutshungulweni kwama-substrates e-SiC?

Sikhiqiza kanjani izinyathelo zokucubungula ama-substrates e-SiC zimi kanje:

1. I-Crystal Orientation: Ukusebenzisa i-X-ray diffraction ukuze uqondise i-crystal ingot. Uma i-X-ray beam iqondiswe kubuso bekristalu obufunwayo, i-engeli ye-diffracted beam inquma umumo wekristalu.

2. Ukugaya Udayamitha Wangaphandle: Amakristalu awodwa akhule ezitsheni ze-graphite ngokuvamile edlula amadayamitha ajwayelekile. Ukugaya ububanzi bangaphandle kuyawehlisa abe osayizi abajwayelekile.

 

3.Qeda Ukugaya Ubuso: Ama-substrates angu-4-intshi we-4H-SiC ngokuvamile anemiphetho emibili yokuma, eyinhloko neyesibili. Ukuqeda ukugaya kobuso kuvula le miphetho yokuma.

4. Ukusaha ngocingo: Ukusaha ngocingo kuyisinyathelo esibalulekile ekucubunguleni ama-substrates e-4H-SiC. Imifantu nomonakalo ongaphansi komhlaba odalwe ngesikhathi sokusaha ngocingo kuba nomthelela ongemuhle ezinqubweni ezilandelayo, ukwelula isikhathi sokucubungula futhi kubangele ukulahleka kwempahla. Indlela ejwayeleke kakhulu ukusaha ngezintambo eziningi nge-diamond abrasive. Ukunyakaza okuphindaphindayo kwezintambo zensimbi eziboshwe ngama-abrasive edayimane kusetshenziswa ukusika ingot engu-4H-SiC.

5. I-Chamfering: Ukuze kuvinjwe ukusika onqenqemeni nokunciphisa ukulahlekelwa okusebenzisekayo phakathi nezinqubo ezilandelayo, imiphetho ecijile yama-chips asanwe ngocingo ayashintshwa abe yizimo ezithile.

6. Ukunciphisa: Ukusaha ngocingo kushiya imihuzuko eminingi kanye nomonakalo ongaphansi komhlaba. Ukucwenga kwenziwa kusetshenziswa amasondo edayimane ukususa lezi ziphambeko ngangokunokwenzeka.

7. Ukugaya: Le nqubo ihlanganisa ukugaya nokugaya kahle kusetshenziswa usayizi omncane we-boron carbide noma ama-abrasives edayimane ukuze kususwe umonakalo osalayo kanye nomonakalo omusha owethulwe ngesikhathi sokuncipha.

8. Ukupholisha: Izinyathelo zokugcina zibandakanya ukupholishwa okungalungile nokupholishwa kahle kusetshenziswa ama-alumina noma ama-silicon oxide abrasives. Uketshezi olupholishwayo luthambisa indawo engaphezulu, esuke ikhishwa ngomshini ngama-abrasives. Lesi sinyathelo siqinisekisa indawo ebushelelezi futhi engonakalisiwe.

9. Ukuhlanza: Ukukhipha izinhlayiya, izinsimbi, amafilimu e-oxide, izinsalela zezinto eziphilayo, nokunye ukungcola okushiywe ezinyathelweni zokucubungula.