I-Semicerauyajabula ukunikezaPFA Cassette, inketho ye-premium yokuphatha i-wafer ezindaweni lapho ukumelana nokuqina kwamakhemikhali kubaluleke kakhulu. Iklanywe ngezinto ezisezingeni eliphezulu ze-Perfluoroalkoxy (PFA), leli khasethi liklanyelwe ukumelana nezimo ezinzima kakhulu ekwenziweni kwe-semiconductor, iqinisekisa ukuphepha nobuqotho bamawafa akho.
Ukumelana Kwamakhemikhali OkungenakuqhathaniswaIPFA Cassetteyakhelwe ukuze inikeze ukumelana okuphakeme nohlu olubanzi lwamakhemikhali, okuyenza ibe ukukhetha okuphelele kwezinqubo ezibandakanya ama-asidi anolaka, izincibilikisi, namanye amakhemikhali anokhahlo. Lokhu kumelana kwamakhemikhali okuqinile kuqinisekisa ukuthi ikhasethi lihlala linjalo futhi lisebenza ngisho nasezindaweni ezigqwala kakhulu, ngaleyo ndlela andise ubude bayo bempilo futhi kuncishiswe isidingo sokushintshwa njalo.
High-Purity ConstructionI-Semicera'sPFA Cassetteikhiqizwa ngezinto ezihlanzekile ze-PFA, ezibaluleke kakhulu ekuvimbeleni ukungcoliswa ngesikhathi sokucutshungulwa kwe-wafer. Lokhu kwakhiwa okuhlanzeke kakhulu kunciphisa ubungozi bokukhiqizwa kwezinhlayiya kanye nokucwiliswa kwamakhemikhali, kuqinisekiswe ukuthi amawafa akho avikelekile ekungcoleni okungabeka engcupheni ikhwalithi yawo.
Ukuqina Nokusebenza OkuthuthukisiweIdizayinelwe ukuqina, iPFA Cassetteigcina ubuqotho bayo besakhiwo ngaphansi kwamazinga okushisa aphezulu kanye nezimo eziqinile zokucubungula. Kungakhathaliseki ukuthi ibhekene namazinga okushisa aphezulu noma ingaphansi kokuphathwa ngokuphindaphindiwe, leli khasethi ligcina isimo nokusebenza kwalo, linikeza ukwethembeka kwesikhathi eside ezindaweni zokukhiqiza ezifunayo.
Ubunjiniyela bokunemba bokuphatha okuvikelekileII-Semicera PFA Cassetteifaka ubunjiniyela obunembayo obuqinisekisa ukuphathwa kwe-wafer okuvikelekile nezinzile. I-slot ngayinye iklanywe ngokucophelela ukuze ibambe ama-wafers endaweni ngokuphephile, ukuvimbela noma yikuphi ukunyakaza noma ukuguquka okungase kubangele umonakalo. Lobu njiniyela obunembayo busekela ukubekwa kwe-wafer okungaguquki nokunembile, okunikela ekusebenzeni kahle kwenqubo iyonke.
Isicelo Esihlukahlukene Kuzo zonke IzinquboNgenxa yezakhiwo zayo eziphakeme zezinto ezibonakalayo, i-PFA Cassetteiguquguquka ngokwanele ukuba isetshenziswe ezigabeni ezahlukahlukene zokwenziwa kwe-semiconductor. Ifaneleka kahle kakhulu i-wet etching, chemical vapor deposition (CVD), nezinye izinqubo ezibandakanya izindawo zamakhemikhali ezinokhahlo. Ukuzivumelanisa nezimo kuyenza ibe ithuluzi elibalulekile ekugcineni ubuqotho benqubo kanye nekhwalithi ye-wafer.
Ukuzibophezela Kukhwalithi kanye NokusungulaKwa-Semicera, sizimisele ukuhlinzeka ngemikhiqizo ehlangabezana namazinga aphezulu kakhulu embonini. IPFA Cassettekuyisibonelo salokhu kuzibophezela, sinikeza isixazululo esithembekile esihlanganisa ngaphandle komthungo ezinqubweni zakho zokukhiqiza. Ikhasethi ngalinye lilawulwa ngokuqinile yikhwalithi ukuze kuqinisekiswe ukuthi lihlangabezana nemibandela yethu yokusebenza eqinile, iletha ubuhle obulindele ku-Semicera.
| Izinto | Ukukhiqiza | Ucwaningo | Dummy |
| I-Crystal Parameters | |||
| I-Polytype | 4H | ||
| Iphutha lokuma kobuso | <11-20 >4±0.15° | ||
| Amapharamitha kagesi | |||
| I-Dopant | n-uhlobo lweNitrojeni | ||
| Ukungazweli | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Ububanzi | 150.0±0.2mm | ||
| Ubukhulu | 350±25 μm | ||
| Umumo oyisicaba oyinhloko | [1-100]±5° | ||
| Ubude obuyisicaba obuyisisekelo | 47.5±1.5mm | ||
| Ifulethi lesibili | Lutho | ||
| I-TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| I-LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Khothama | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| I-Wap | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | I-Ra≤0.2nm (5μm*5μm) | ||
| Isakhiwo | |||
| Ukuminyana kwe-Micropipe | <1 eya/cm2 | <10 kwe/cm2 | <15 kwe/cm2 |
| Ukungcola kwensimbi | ≤5E10 ama-athomu/cm2 | NA | |
| I-BPD | ≤1500 i-e/cm2 | ≤3000 i-e/cm2 | NA |
| I-TSD | ≤500 i-e/cm2 | ≤1000 i-e/cm2 | NA |
| Ikhwalithi Yangaphambili | |||
| Ngaphambili | Si | ||
| Ukuqedwa kobuso | I-Si-face CMP | ||
| Izinhlayiya | ≤60ea/wafer (usayizi≥0.3μm) | NA | |
| Ukuklwebheka | ≤5ea/mm. Ubude obuqongelelwe ≤Ububanzi | Ubude obuqongelelwe≤2*Ububanzi | NA |
| Ikhasi eliwolintshi/imigodi/amabala/ama-striations/ imifantu/ukungcola | Lutho | NA | |
| Ama-Edge chips/indents/fracture/hex plate | Lutho | ||
| Izindawo ze-Polytype | Lutho | Indawo eqoqiwe≤20% | Indawo eqoqiwe≤30% |
| Ukumaka kwe-laser yangaphambili | Lutho | ||
| Ikhwalithi Emuva | |||
| Emuva ekupheleni | C-face CMP | ||
| Ukuklwebheka | ≤5ea/mm, Ubude obuqongelelayo≤2*Ububanzi | NA | |
| Ukukhubazeka kwasemuva (ama-edge chips/indents) | Lutho | ||
| Ukuhwalala emuva | I-Ra≤0.2nm (5μm*5μm) | ||
| Ukumaka kwe-laser emuva | 1 mm (kusuka emaphethelweni aphezulu) | ||
| Umphetho | |||
| Umphetho | I-Chamfer | ||
| Ukupakisha | |||
| Ukupakisha | I-Epi-ilungile ngokufakwa kwe-vacuum Ukupakishwa kwekhasethi le-multi-wafer | ||
| *Amanothi: "NA" kusho ukuthi asikho isicelo Izinto ezingashiwongo zingabhekisa ku-SEMI-STD. | |||
