I-Semicerawethula iIkhasethi leSemiconductor, ithuluzi elibalulekile lokuphatha okuphephile nokusebenza kahle kwamawafa kuyo yonke inqubo yokukhiqiza i-semiconductor. Iklanywe ngokunemba okuphezulu, leli khasethi liqinisekisa ukuthi amawafa akho agcinwa ngokuphephile futhi athuthwa, agcina ubuqotho bawo ngaso sonke isikhathi.
Ukuvikelwa Okuphakeme NokuqinaIIkhasethi leSemiconductorkusuka ku-Semicera yakhelwe ukunikeza ukuvikeleka okuphezulu kuma-wafers akho. Yakhiwe ngezinto eziqinile, ezimelana nokungcoliswa, ivikela amawafa akho ekulimaleni okungaba khona kanye nokungcola, ikwenze kube ukukhetha okuhle kwezindawo zegumbi elihlanzekile. Idizayini yekhasethi inciphisa ukukhiqizwa kwezinhlayiya futhi iqinisekisa ukuthi ama-wafer ahlala engathintwa futhi evikelekile ngesikhathi sokuphatha nokuthuthwa.
Idizayini Ethuthukisiwe Yokusebenza OkufanelekileI-Semicera'sIkhasethi leSemiconductorinomklamo oklanywe ngobunyoninco ohlinzeka ngokuqondana kwewafa okunembe, enciphisa ubungozi bokungaqondani kahle kanye nokulimala kokusebenza. Izikhala zekhasethi zihlukaniswe kahle ukuze zibambe iwafa ngayinye ngokuvikelekile, ukuvimbela noma yikuphi ukunyakaza okungase kubangele imihuzuko noma okunye ukungapheleli.
Ukuhlukahluka NokuhambisanaIIkhasethi leSemiconductoriguquguquka futhi iyahambisana nosayizi abahlukahlukene be-wafer, okuyenza ifanele izigaba ezahlukahlukene zokwenziwa kwe-semiconductor. Kungakhathaliseki ukuthi usebenza ngobukhulu obujwayelekile noma obungokwezifiso be-wafer, leli khasethi livumelana nezidingo zakho, linikeza ukuguquguquka ezinqubweni zakho zokukhiqiza.
Ukuphatha Okulula kanye NempumeleloYakhelwe kucatshangelwa umsebenzisi, iIkhasethi le-Semicenductor Semiconductorayisindi futhi kulula ukuyiphatha, okuvumela ukulayisha nokuthulula okusheshayo nangempumelelo. Lo mklamo we-ergonomic awugcini nje ngokusindisa isikhathi kodwa futhi unciphisa ubungozi bephutha lomuntu, uqinisekise ukusebenza kahle ngaphakathi kwendawo yakho.
Amazinga Emboni YokuhlanganaI-Semicera iqinisekisa ukuthi i-Ikhasethi leSemiconductorihlangabezana namazinga aphezulu embonini ngekhwalithi nokuthembeka. Ikhasethi ngalinye lihlolwa kanzima ukuze kuqinisekiswe ukuthi lisebenza ngokungaguquki ngaphansi kwezimo ezidingekayo zokukhiqiza ama-semiconductor. Lokhu kuzinikela kwikhwalithi kuqinisekisa ukuthi ama-wafers akho avikelekile njalo, agcina amazinga aphezulu adingekayo embonini.
| Izinto | Ukukhiqiza | Ucwaningo | Dummy |
| I-Crystal Parameters | |||
| I-Polytype | 4H | ||
| Iphutha lokuma kobuso | <11-20 >4±0.15° | ||
| Amapharamitha kagesi | |||
| I-Dopant | n-uhlobo lweNitrojeni | ||
| Ukungazweli | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Ububanzi | 150.0±0.2mm | ||
| Ubukhulu | 350±25 μm | ||
| Umumo oyisicaba oyinhloko | [1-100]±5° | ||
| Ubude obuyisicaba obuyisisekelo | 47.5±1.5mm | ||
| Ifulethi lesibili | Lutho | ||
| I-TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| I-LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Khothama | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| I-Wap | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | I-Ra≤0.2nm (5μm*5μm) | ||
| Isakhiwo | |||
| Ukuminyana kwe-Micropipe | <1 eya/cm2 | <10 kwe/cm2 | <15 kwe/cm2 |
| Ukungcola kwensimbi | ≤5E10 ama-athomu/cm2 | NA | |
| I-BPD | ≤1500 i-e/cm2 | ≤3000 i-e/cm2 | NA |
| I-TSD | ≤500 i-e/cm2 | ≤1000 i-e/cm2 | NA |
| Ikhwalithi Yangaphambili | |||
| Ngaphambili | Si | ||
| Ukuqedwa kobuso | I-Si-face CMP | ||
| Izinhlayiya | ≤60ea/wafer (usayizi≥0.3μm) | NA | |
| Ukuklwebheka | ≤5ea/mm. Ubude obuqongelelwe ≤Ububanzi | Ubude obuqongelelwe≤2*Ububanzi | NA |
| Ikhasi eliwolintshi/imigodi/amabala/imifantu/ukungcola | Lutho | NA | |
| Ama-Edge chips/indents/fracture/hex plate | Lutho | ||
| Izindawo ze-Polytype | Lutho | Indawo eqoqiwe≤20% | Indawo eqoqiwe≤30% |
| Ukumaka kwe-laser yangaphambili | Lutho | ||
| Ikhwalithi Emuva | |||
| Emuva ekupheleni | C-face CMP | ||
| Ukuklwebheka | ≤5ea/mm,Ubude obuqongelelayo≤2*Ububanzi | NA | |
| Ukukhubazeka kwasemuva (ama-edge chips/indents) | Lutho | ||
| Ukuhwalala emuva | I-Ra≤0.2nm (5μm*5μm) | ||
| Ukumaka kwe-laser emuva | 1 mm (kusuka emaphethelweni aphezulu) | ||
| Umphetho | |||
| Umphetho | I-Chamfer | ||
| Ukupakisha | |||
| Ukupakisha | I-Epi-ilungile ngokufakwa kwe-vacuum Ukupakishwa kwekhasethi le-multi-wafer | ||
| *Amanothi: "NA" kusho ukuthi asikho isicelo Izinto ezingashiwongo zingabhekisa ku-SEMI-STD. | |||
