I-Wafer ye-Silicon On Insulator (SOI) ye-Semicera iphambili ekusungulweni kwe-semiconductor, enikeza ukuhlukaniswa kukagesi okuthuthukisiwe nokusebenza okushisayo okuphakeme. Isakhiwo se-SOI, esihlanganisa ungqimba oluncane lwe-silicon ku-substrate evikelayo, sinikeza izinzuzo ezibalulekile zemishini kagesi esebenza kahle kakhulu.
Ama-wafers ethu e-SOI aklanyelwe ukunciphisa amandla e-parasitic kanye nokuvuza kwemisinga, okubalulekile ekuthuthukiseni amasekhethi ahlanganisiwe anesivinini esikhulu nanamandla aphansi. Lobu buchwepheshe obuthuthukisiwe buqinisekisa ukuthi izisetshenziswa zisebenza kahle kakhulu, ngesivinini esithuthukisiwe kanye nokuncipha kokusetshenziswa kwamandla, okubalulekile kuma-electronics wesimanje.
Izinqubo ezithuthukisiwe zokukhiqiza eziqashwe yi-Semicera ziqinisekisa ukukhiqizwa kwama-wafers e-SOI ngokufana okuhle kakhulu nokuvumelana. Le khwalithi ibalulekile ezinhlelweni zokuxhumana ngezingcingo, ezezimoto, nezinto zikagesi zabathengi, lapho kudingeka khona izingxenye ezithembekile nezisebenza kakhulu.
Ngokungeziwe ezinzuzweni zabo zikagesi, amawafa e-SOI e-Semicera anikeza ukufakwa okushisayo okuphakeme, okukhuphula ukunqamuka kokushisa nokuzinza kumadivayisi aminyana kakhulu nanamandla amakhulu. Lesi sici sibaluleke kakhulu ezinhlelweni ezibandakanya ukukhiqiza ukushisa okubalulekile futhi ezidinga ukuphathwa okusebenzayo kokushisa.
Ngokukhetha I-Silicon Ye-Semicera Ku-Insulator Wafer, utshala imali emkhiqizweni osekela ukuthuthukiswa kobuchwepheshe obusezingeni eliphezulu. Ukuzibophezela kwethu kukhwalithi kanye nokusungula izinto kuqinisekisa ukuthi ama-wafers ethu e-SOI ahlangabezana nezidingo ezinzima zemboni ye-semiconductor yanamuhla, okuhlinzeka ngesisekelo semishini kagesi yesizukulwane esilandelayo.
| Izinto | Ukukhiqiza | Ucwaningo | Dummy |
| I-Crystal Parameters | |||
| I-Polytype | 4H | ||
| Iphutha lokuma kobuso | <11-20 >4±0.15° | ||
| Amapharamitha kagesi | |||
| I-Dopant | n-uhlobo lweNitrojeni | ||
| Ukungazweli | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Ububanzi | 150.0±0.2mm | ||
| Ubukhulu | 350±25 μm | ||
| Umumo oyisicaba oyinhloko | [1-100]±5° | ||
| Ubude obuyisicaba obuyisisekelo | 47.5±1.5mm | ||
| Ifulethi lesibili | Lutho | ||
| I-TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| I-LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Khothama | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| I-Wap | ≤35 μm | ≤45 μm | ≤55 μm |
| Front(Si-face) roughness(AFM) | I-Ra≤0.2nm (5μm*5μm) | ||
| Isakhiwo | |||
| Ukuminyana kwe-Micropipe | <1 eya/cm2 | <10 kwe/cm2 | <15 kwe/cm2 |
| Ukungcola kwensimbi | ≤5E10 ama-athomu/cm2 | NA | |
| I-BPD | ≤1500 i-e/cm2 | ≤3000 i-e/cm2 | NA |
| I-TSD | ≤500 i-e/cm2 | ≤1000 i-e/cm2 | NA |
| Ikhwalithi Yangaphambili | |||
| Ngaphambili | Si | ||
| Ukuqedwa kobuso | I-Si-face CMP | ||
| Izinhlayiya | ≤60ea/wafer (usayizi≥0.3μm) | NA | |
| Ukuklwebheka | ≤5ea/mm. Ubude obuqongelelwe ≤Ububanzi | Ubude obuqongelelwe≤2*Ububanzi | NA |
| Ikhasi eliwolintshi/imigodi/amabala/imifantu/ukungcola | Lutho | NA | |
| Ama-Edge chips/indents/fracture/hex plate | Lutho | ||
| Izindawo ze-Polytype | Lutho | Indawo eqoqiwe≤20% | Indawo eqoqiwe≤30% |
| Ukumaka kwe-laser yangaphambili | Lutho | ||
| Ikhwalithi Emuva | |||
| Emuva ekupheleni | C-face CMP | ||
| Ukuklwebheka | ≤5ea/mm,Ubude obuqongelelayo≤2*Ububanzi | NA | |
| Ukukhubazeka kwasemuva (ama-edge chips/indents) | Lutho | ||
| Ukuhwalala emuva | I-Ra≤0.2nm (5μm*5μm) | ||
| Ukumaka kwe-laser emuva | 1 mm (kusuka emaphethelweni aphezulu) | ||
| Umphetho | |||
| Umphetho | I-Chamfer | ||
| Ukupakisha | |||
| Ukupakisha | I-Epi-ilungile ngokufakwa kwe-vacuum Ukupakishwa kwekhasethi le-multi-wafer | ||
| *Amanothi: "NA" kusho ukuthi asikho isicelo Izinto ezingashiwongo zingabhekisa ku-SEMI-STD. | |||
