I-Wafer Handling Arm

Incazelo emfushane:

I-Silicon Carbide Vacuum Chuck kanye ne-Wafer Handling Arm yenziwa inqubo yokucindezela ye-isostatic kanye nokushisa okuphezulu kwe-sintering. Ubukhulu bangaphandle, ukujiya kanye nokwakheka kungaqedwa ngokuya ngemidwebo yedizayini yomsebenzisi ukuze kuhlangatshezwane nezidingo eziqondile zomsebenzisi.

 


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ingalo ephethe i-waferiyithuluzi elibalulekile elisetshenziswa enqubweni yokukhiqiza i-semiconductor ukuphatha, ukudluliswa kanye nesikhundlaizinkwa eziwucwecwe. Ngokuvamile iqukethe ingalo yerobhothi, i-gripper kanye nesistimu yokulawula, enekhono elinembile lokunyakaza nokubeka indawo.I-wafer ephethe izingaloasetshenziswa kakhulu kuzixhumanisi ezahlukahlukene ekukhiqizeni ama-semiconductor, okubandakanya izinyathelo zenqubo ezifana nokulayisha i-wafer, ukuhlanza, ukubekwa kwefilimu emincane, i-etching, i-lithography kanye nokuhlola. Ukunemba kwayo, ukwethembeka namandla ayo okuzenzakalela kubalulekile ukuze kuqinisekiswe ikhwalithi, ukusebenza kahle kanye nokungaguquguquki kwenqubo yokukhiqiza.

Imisebenzi eyinhloko yengalo yokuphatha i-wafer ihlanganisa:

1. Ukudluliswa kwe-wafer: Ingalo ephethe i-wafer iyakwazi ukudlulisa ngokunembile ama-wafers ukusuka endaweni eyodwa kuya kwenye, njengokuthatha ama-wafers endaweni yokubeka isitoreji futhi uwabeke kudivayisi yokucubungula.

2. Ukuma nokuma: Ingalo ephethe i-wafer iyakwazi ukubeka ngokunembile futhi iqondise i-wafer ukuze kuqinisekiswe ukuqondana okulungile kanye nokuma kokucubungula okulandelayo noma imisebenzi yokukala.

3. Ukubamba nokukhulula: Izingalo ezibamba i-wafer ngokuvamile zifakwe izinto zokubamba ezingabamba ngokuphephile ama-wafers futhi ziwakhulule lapho kudingeka ukuze kuqinisekiswe ukudluliswa okuphephile nokubamba ama-wafers.

4. Ukulawula okuzenzakalelayo: Ingalo ephethe i-wafer ifakwe isistimu yokulawula ethuthukisiwe engakwazi ukwenza ngokuzenzakalelayo ukulandelana kwesenzo esinqunywe kusengaphambili, ithuthukise ukusebenza kahle kokukhiqiza futhi inciphise amaphutha abantu.

I-Wafer Handling Arm-晶圆处理臂

Izimpawu kanye nezinzuzo

1.Izilinganiso eziqondile kanye nokuzinza kokushisa.

I-2.Ukuqina okuqondile okuphezulu kanye nokufana okuhle kakhulu kokushisa, ukusetshenziswa kwesikhathi eside akulula ukugoba ukuguqulwa.

I-3.Inobuso obushelelezi nokumelana okuhle kokugqoka, ngaleyo ndlela iphathe ngokuphepha i-chip ngaphandle kokungcola kwezinhlayiyana.

I-4.I-silicon carbide resistivity ku-106-108Ω, engeyona i-magnetic, ngokuhambisana nezidingo zokucaciswa kwe-anti-ESD; Kungavimbela ukunqwabelana kukagesi omile ebusweni be-chip.

I-5.I-conductivity enhle yokushisa, i-coefficient ephansi yokwandisa.

Semicera Indawo yokusebenza
Indawo yokusebenza ye-Semicera 2
Umshini wezinsimbi
Ukucubungula kwe-CNN, ukuhlanzwa kwamakhemikhali, i-CVD coating
I-Semicera Ware House
Inkonzo yethu

  • Okwedlule:
  • Olandelayo: