Imishini yokusika i-laser microjet (LMJ) ingasetshenziswa embonini ye-semiconductor

Incazelo emfushane:

I-Laser microjet technology (LMJ) iyindlela yokucubungula i-laser ehlanganisa i-laser nejethi lamanzi “elincane njengezinwele”, futhi iqondisa kahle i-laser beam endaweni yokucubungula ngokusebenzisa i-pulse total reflection in the micro-water jet ngendlela. efana ne-fiber optical yendabuko.Ijethi lamanzi lipholisa ngokuqhubekayo indawo yokusika futhi isuse ngempumelelo udoti wokucubungula.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izinzuzo zokucutshungulwa kwe-LMJ

Ukukhubazeka okungokwemvelo kokucutshungulwa kwe-laser okujwayelekile kunganqotshwa ngokusebenzisa ubuchwepheshe be-laser Laser micro jet (LMJ) ukusabalalisa izici zokubona kwamanzi nomoya.Lobu buchwepheshe buvumela ama-laser pulses abonakale ngokugcwele kujethi yamanzi ahlanzekile acutshungulwe ngendlela engaphazamiseki ukuze afinyelele endaweni yomshini njengakufiber optical.

Imishini yokucubungula i-Microjet laser-2-3

Izici eziyinhloko zobuchwepheshe be-LMJ yilezi:

1. I-laser beam iyisakhiwo sekholomu (efanayo).

2. I-laser pulse idluliselwa kujethi yamanzi njenge-fiber optical, ngaphandle kokuphazanyiswa kwemvelo.

3. I-laser beam igxile emishinini ye-LMJ, futhi ukuphakama kwendawo yomshini akushintshi phakathi nayo yonke inqubo yokucubungula, ngakho-ke ayidingi ukuqhubeka nokugxila ekushintsheni kokujula kokucubungula ngesikhathi sokucubungula.

4. Hlanza ubuso ngokuqhubekayo.

i-micro-jet laser cutting technolgoy (1)

5. Ngaphezu kokukhishwa kwempahla yokusebenza ngomshini we-laser ngamunye, isikhathi ngasinye seyunithi eyodwa kusukela ekuqaleni kokushaya ngakunye kuya ekushayeni okulandelayo, okokusebenza okucutshunguliwe kusesimweni sangempela samanzi okupholisa isikhathi esingaba ngu-99% wesikhathi. , ecishe iqede indawo ethintekile ekushiseni kanye nesendlalelo se-remelt, kodwa igcina ukusebenza kahle okuphezulu kokucubungula.

Ukucaciswa okujwayelekile	I-LCSA-100	I-LCSA-200
Ivolumu ye-Countertop	125 x 200 x 100	460×460×300
I-eksisi yomugqa XY	Injini yomugqa.Injini yomugqa	Injini yomugqa.Injini yomugqa
I-eksisi yomugqa Z	100	300
Ukubeka ukunemba μm	+/- 5	+/- 3
Ukunemba kokuma okuphindaphindiwe μm	+/- 2	+/- 1
Ukusheshisa G	0.5	1
Ukulawula izinombolo	3-eksisi	3-eksisi
Li-aser
Uhlobo lwe-laser	I-DPSS Nd: YAG	I-DPSS Nd: YAG, ishayela
Ubude begagasi nm	532/1064	532/1064
Amandla alinganiselwe W	50/100/200	200/400
Indiza yamanzi
Ububanzi benozili μm	25-80	25-80
Ibha yokucindezela yeNozzle	100-600	0-600
Ubukhulu/Isisindo
Ubukhulu (Umshini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Ubukhulu (ikhabethe lokulawula) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Isisindo (impahla) kg	1170	2500-3000
Isisindo (ikhabethe lokulawula) kg	700-750	700-750
Ukusetshenziswa kwamandla okuphelele
Input	I-AC 230 V +6%/ -10%, i-unidirectional 50/60 Hz ±1%	I-AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%
Inani eliphakeme	2.5kVA	2.5kVA
Juwoni	10 m ikhebula lamandla: P+N+E, 1.5 mm2	10 m ikhebula lamandla: P+N+E, 1.5 mm2
Ibanga lesicelo somsebenzisi wemboni ye-semiconductor	≤4 amayintshi ingot eyindilinga ≤4 amayintshi ama-ingot tincetu ≤4 amayintshi ama-ingot scribing	≤6 amayintshi ayindilinga ayindilinga ≤6 intshi izingcezu zengot ≤6 amayintshi ingot scribing Umshini uhlangabezana nevelu yethiyori eyindilinga engu-8-intshi/ukusika/ukusika, futhi imiphumela ethile ephathekayo idinga isu lokusika elithuthukisiwe.